EN 16602-70-08:2015

Foreword
Introduction
1 Scope
2 Normative references
3 Terms, definitions and abbreviated terms
4 Principles of reliable soldered connections
5 Preparatory conditions
6 Materials selection
7 Preparation for soldering
8 Mounting of components
9 Attachment of conductors to terminals, solder
   cups and cables
10 Soldering to terminals and PCBs
11 Cleaning of PCB assemblies
12 Final inspection
13 Verification procedure
14 Quality assurance
15 Workmanship standards
Annex A (normative) - Report on manual soldering
        of high-reliability electrical connections - DRD
Annex B (informative) - Solder melting temperatures
        and choice
Bibliography

This Standard defines the technical requirements and quality assurance provisions for the manufacture and verification of manually-soldered, high-reliability electrical connections. The Standard defines acceptance and rejection criteria for high reliability manufacture of manually-soldered electrical connections intended to withstand normal terrestrial conditions and the vibrational g-loads and environment imposed by space flight. The proper tools, correct materials, design and workmanship are covered by this document. Workmanship standards are included to permit discrimination between proper and improper work. The assembly of surface-mount devices is covered in ECSS-Q-ST-70-38. Requirements related to printed circuit boards are contained in ECSS-Q-ST-70-10 and ECSS-Q-ST-70-11. Verification of manual soldering assemblies which are not described in this standard are performed by vibration and thermal cycling testing. The requirements for verification are given in this Standard. This standard does not cover the qualification and acceptance of EQM and FM equipment with hand soldered connections. The qualification and acceptance tests of equipment manufactured in accordance with this Standard are covered by ECSS-E-ST-10-03. The mounting and supporting of components, terminals and conductors prescribed herein applies to assemblies designed to operate within the temperature limits of -55 °C to +85 °C. For temperatures outside this normal range, special design, verification and qualification testing is performed to ensure the necessary environmental survival capability. Special thermal heat sinks are applied to devices having high thermal dissipation (e.g. junction temperatures of 110 °C, power transistors) in order to ensure that solder joints do not exceed 85 °C. This standard may be tailored for the specific characteristic and constrains of a space project in conformance with ECSS-S-ST-00.