• CEI EN 60068-2-20 : 2009

    Current The latest, up-to-date edition.

    ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS

    Available format(s):  Hardcopy, PDF

    Language(s):  English - Italian

    Published date:  01-01-2009

    Publisher:  Comitato Elettrotecnico Italiano

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    Table of Contents - (Show below) - (Hide below)

    1 Scope and object
    2 Normative references
    3 Terms and definitions
    4 Test Ta: Solderability of
      wire and tag terminations
    5 Test Tb: Resistance to
      soldering heat
    Annex A (informative) - Example
            of apparatus for
            accelerated steam ageing
            process
    Annex B (normative) - Specification
            for flux constituents
    Bibliography
    Annex ZA (normative) - Normative
             references to international
             publications with their
             corresponding European
             publications

    Abstract - (Show below) - (Hide below)

    Gives procedures for determining The solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys.

    General Product Information - (Show below) - (Hide below)

    Committee CT 309
    Development Note Classificazione CEI 91-58. Supersedes CEI 50-8/4. (03/2009)
    Document Type Standard
    Publisher Comitato Elettrotecnico Italiano
    Status Current
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    EN 60068-2-2:2007 ENVIRONMENTAL TESTING - PART 2-2: TESTS - TEST B: DRY HEAT
    EN 60068-1:2014 ENVIRONMENTAL TESTING - PART 1: GENERAL AND GUIDANCE (IEC 60068-1:2013)
    IEC 60068-2-66:1994 Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour)
    EN 61191-3:2017 PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES (IEC 61191-3:2017)
    IEC 60068-2-54:2006 Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
    IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    EN 60068-2-78:2013 ENVIRONMENTAL TESTING - PART 2-78: TESTS - TEST CAB: DAMP HEAT, STEADY STATE (IEC 60068-2-78:2012)
    IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
    EN 60068-2-66:1994 ENVIRONMENTAL TESTING - PART 2: TEST METHODS - TEST CX: DAMP HEAT, STEADY STATE (UNSATURATED PRESSURIZED VAPOUR)
    IEC 60068-2-69:2017 Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
    EN 60194:2006 PRINTED BOARD DESIGN, MANUFACTURE AND ASSEMBLY - TERMS AND DEFINITIONS
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
    EN 61191-4:2017 PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
    IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
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