EN 60191-6-20:2010

Current

Current The latest, up-to-date edition.

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)

Available format(s):

Language(s):

Published date: 15-10-2010

Publisher: European Committee for Standards - Electrical

Pure ENs are not available for sale, please purchase a suitable national adoption

Abstract - (Show below) - (Hide below)

IEC 60191-6-20:2010 specifies methods to measure package dimensions of small outline J-lead-packages (SOJ), package outline form E in accordance with IEC 60191-4.

General Product Information - (Show below) - (Hide below)

Committee	CLC/SR 47D
Document Type	Standard
ISBN
Pages
Published
Publisher	European Committee for Standards - Electrical
Status	Current

National Adoptions - (Show below) - (Hide below)

Equivalent Standard(s)	Relationship
IEC 60191-6-20:2010	Identical
NF EN 60191-6-20 : 2011	Identical
NBN EN 60191-6-20 : 2010	Identical
NEN EN IEC 60191-6-20 : 2010	Identical
PN EN 60191-6-20 : 2011	Identical
UNE-EN 60191-6-20:2010	Identical
BS EN 60191-6-20:2010	Identical
CEI EN 60191-6-20 : 2011	Identical
DIN EN 60191-6-20:2011-03	Identical

Standards Referenced By This Book - (Show below) - (Hide below)

EN IEC 60191-1:2018	Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
I.S. EN IEC 60191-1:2018	MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES

Standards Referencing This Book - (Show below) - (Hide below)

IEC 60191-6:2009	Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60191-4:2013	Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
EN 60191-6:2009	Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

Categories associated with this Standard - (Show below) - (Hide below)

Sub-Categories associated with this Standard - (Show below) - (Hide below)

Sorry this product is not available in your region.

Add To Cart