EN 60749-1:2003
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 1: General
20-06-2003
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and letter symbols
4 Standard atmospheric conditions
5 Electrical measurements
6 Use of electrically defective devices
Applicable to semiconductor devices (discrete devices and integrated circuits) and establishes provisions common to all the other parts of the series.
| Committee |
CLC/TC 47X
|
| DevelopmentNote |
Supersedes EN 60749 (07/2003)
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| IEC 60749-1:2002 | Identical |
| NF EN 60749-1 : 2003 | Identical |
| UNE-EN 60749-1:2004 | Identical |
| NBN EN 60749-1 : 2004 | Identical |
| NEN EN IEC 60749-1 : 2003 | Identical |
| I.S. EN 60749-1:2003 | Identical |
| PN EN 60749-1 : 2005 | Identical |
| SN EN 60749-1 : 2003 | Identical |
| BS EN 60749-1:2003 | Identical |
| CEI EN 60749-1 : 2005 | Identical |
| DIN EN 60749-1:2003-12 | Identical |
| BS EN 61747-1:2000 | Liquid crystal and solid-state display devices Generic specification |
| BS EN 62137-4:2014 | Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices |
| EN 62137-4:2014/AC:2015 | ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES (IEC 62137-4:2014) |
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