EN 60749-4:2017
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
16-06-2017
IEC 60749-4:2017(E) provides a highly accelerated temperature and humidity stress test (HAST) for the purpose of evaluating the reliability of non-hermetic packaged semiconductor devices in humid environments. This edition includes the following significant technical changes with respect to the previous edition:a) clarification of requirements for temperature, relative humidity and duration detailed in Table 1;b) recommendations that current limiting resistor(s) be placed in the test set-up to prevent test board or DUT damage;c) allowance of additional time-to-test delay or return-to-stress delay.
| Committee |
CLC/TC 47X
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Current
|
| Standards | Relationship |
| DIN EN 60749-4:2016-06 (Draft) | Identical |
| IEC 60749-4:2017 | Identical |
| NF EN 60749-4 : 2002 | Identical |
| UNE-EN 60749-4:2003 | Identical |
| NBN EN 60749-4 : 2003 | Identical |
| NEN EN IEC 60749-4 : 2017 | Identical |
| I.S. EN 60749-4:2017 | Identical |
| PN EN 60749-4 : 2017 | Identical |
| UNE-EN 60749-4:2017 | Identical |
| NF EN 60749-4:2017 | Identical |
| BS EN 60749-4:2002 | Identical |
| CEI EN 60749-4 : 2004 | Identical |
| BS EN 60749-4:2017 | Identical |
| PNE-FprEN 60749-4:2016 | Identical |
| BS EN 60745-2-4:2009+A11:2011 | Identical |
| BS EN 60749-30 : 2005 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING |
| EN 60749-5:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test |
| CEI EN 60749-5 : 2005 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 5: STEADY-STATE TEMPERATURE HUMIDITY BIAS LIFE TEST |
| EN 60749-30 : 2005 AMD 1 2011 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING |
| BS EN 60749-5:2017 | Semiconductor devices. Mechanical and climatic test methods Steady-state temperature humidity bias life test |
| I.S. EN 60749-30:2005 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING |
| I.S. EN 60749-5:2017 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 5: STEADY-STATE TEMPERATURE HUMIDITY BIAS LIFE TEST (IEC 60749-5:2017) |
| IEC 60749-5:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test |
| EN 60749-5:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test |
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