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CENELEC
EN 62047-1:2016

EN 62047-1:2016

Current

Current

The latest, up-to-date edition.

Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions

Published date

08-04-2016

Publisher

European Committee for Standards - Electrical

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FOREWORD
1 Scope
2 Terms and definitions
Annex A (informative) - Standpoint and criteria in editing
        this glossary
Annex B (informative) - Clause cross-references of
        IEC 62047-1:2005 and IEC 62047-1:2015
Bibliography

IEC 62047-1:2016 defines terms for micro-electromechanical devices including the process of production of such devices.This edition includes the following significant technical changes with respect to the previous edition:a) removal of ten terms;b) revision of twelve terms;c) addition of sixteen new terms.

Committee
CLC/TC 47X
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Current

BS EN 62047-25:2016 Semiconductor devices. Micro-electromechanical devices Silicon based MEMS fabrication technology. Measurement method of pull-press and shearing strength of micro bonding area
I.S. EN 62047-4:2010 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 4: GENERIC SPECIFICATION FOR MEMS
CEI EN 60876-1 : 2015 FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS - FIBRE OPTIC SPATIAL SWITCHES - PART 1: GENERIC SPECIFICATION
I.S. EN 62047-14:2012 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 14: FORMING LIMIT MEASURING METHOD OF METALLIC FILM MATERIALS (IEC 62047-14:2012 (EQV))
BS EN 60876-1:2014 Fibre optic interconnecting devices and passive components. Fibre optic spatial switches Generic specification
BS EN 62047-14:2012 Semiconductor devices. Micro-electromechanical devices Forming limit measuring method of metallic film materials
I.S. EN 62047-25:2016 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 25: SILICON BASED MEMS FABRICATION TECHNOLOGY - MEASUREMENT METHOD OF PULL-PRESS AND SHEARING STRENGTH OF MICRO BONDING AREA
CEI EN 62047-14 : 2013 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 14: FORMING LIMIT MEASURING METHOD OF METALLIC FILM MATERIALS
BS EN 62047-4:2010 Semiconductor devices. Micro-electromechanical devices Generic specification for MEMS
EN 62047-14:2012 Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials
EN 62047-4:2010 Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
CEI EN 62047-4 : 2011 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 4: GENERIC SPECIFICATION FOR MEMS
CEI EN 62047-25 : 1ED 2017 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 25: SILICON BASED MEMS FABRICATION TECHNOLOGY - MEASUREMENT METHOD OF PULL-PRESS AND SHEARING STRENGTH OF MICRO BONDING AREA
I.S. EN 60876-1:2014 FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS - FIBRE OPTIC SPATIAL SWITCHES - PART 1: GENERIC SPECIFICATION
EN 60876-1:2014 Fibre optic interconnecting devices and passive components - Fibre optic spatial switches - Part 1: Generic specification

IEC 60050-815:2015 International Electrotechnical Vocabulary (IEV) - Part 815: Superconductivity
ISO 2041:2009 Mechanical vibration, shock and condition monitoring Vocabulary
IEC 60050-521:2002 International Electrotechnical Vocabulary (IEV) - Part 521: Semiconductor devices and integrated circuits

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