EN 62047-10 : 2011
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 10: MICRO-PILLAR COMPRESSION TEST FOR MEMS MATERIALS (IEC 62047-10:2011)
09-09-2011
FOREWORD
1 Scope
2 Normative references
3 Symbols and designations
4 Test piece
5 Testing method and test apparatus
6 Test report
Annex A (informative) - Error estimation using
finite element method
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
IEC 62047-10:2011 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication.
| Committee |
SR 47F
|
| DocumentType |
Test Method
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Current
|
| Standards | Relationship |
| IEC 62047-10:2011 | Identical |
| NBN EN 62047-10 : 2011 | Identical |
| PN EN 62047-10 : 2012 | Identical |
| BS EN 62047-10:2011 | Identical |
| DIN EN 62047-10:2012-03 | Identical |
| NEN EN IEC 62047-10 : 2011 | Identical |
| UNE-EN 62047-10:2011 | Identical |
| CEI EN 62047-10 : 2012 | Identical |
| I.S. EN 62047-10:2011 | Identical |
| NF EN 62047-10 : 2012 | Identical |
| PNE-FprEN 62047-10:2010 | Identical |
| ASTM E 9 : 2009 | Standard Test Methods of Compression Testing of Metallic Materials at Room Temperature |
| IEC 62047-8:2011 | Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films |
| EN 62047-8:2011 | Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films |
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