• There are no items in your cart

EN 62047-5:2011

Current

Current

The latest, up-to-date edition.

Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches

Published date

19-08-2011

Sorry this product is not available in your region.

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Essential ratings and characteristics
5 Measuring methods
6 Reliability (performance)
Annex A (informative) - General description of RF MEMS
        Switches
Annex B (informative) - Geometry of RF MEMS switches
Annex C (informative) - Packaging of RF MEMS switches
Annex D (informative) - Failure mechanism of RF MEMS switches
Annex E (informative) - Applications of RF MEMS switches
Annex F (informative) - Measurement procedure of RF MEMS
        switches
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

IEC 62047-5:2011 describes terminology, definition, symbols, test methods that can be used to evaluate and determine the essential ratings and characteristic parameters of RF MEMS switches. The statements made in this standardization are also applicable to RF (Radio Frequency) MEMS (Micro-Electro-Mechanical Systems) switches with various structures, contacts (d.c. contact and capacitive contact), configurations (series and shunt), switching networks (SPST, SPDT, DPDT, etc.), and actuation mechanism such as electrostatic, electro-thermal, electromagnetic, piezoelectric, etc. The RF MEMS switches are promising devices in advanced mobile phones with multi-band/mode operation, smart radar systems, reconfigurable RF devices and systems, SDR (Software Defined Radio) phones, test equipments, tunable devices and systems, satellite, etc. The contents of the corrigendum of March 2012 have been included in this copy.

Committee
CLC/TC 47X
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Current

IEC 60749-5:2017 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
IEC 60749-27:2006+AMD1:2012 CSV Semiconductor devices - Mechanical and climatic test methods - Part27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
IEC 60747-16-4:2004+AMD1:2009+AMD2:2017 CSV Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
EN 60749-5:2017 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
EN 60749-27:2006/A1:2012 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 27: ELECTROSTATIC DISCHARGE (ESD) SENSITIVITY TESTING - MACHINE MODEL (MM)
EN 60749-10:2002 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
IEC 60747-1:2006+AMD1:2010 CSV Semiconductor devices - Part 1: General
EN 60747-16-1:2002/A2:2017 SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS (IEC 60747-16-1:2001/A2:2017)
IEC 60747-16-1:2001+AMD1:2007+AMD2:2017 CSV Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
IEC 60749-10:2002 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
IEC 60749-12:2002 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
EN 60749-12:2002 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.