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CENELEC
ES 59008-1 : 1999

ES 59008-1 : 1999

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by

DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 1 - GENERAL REQUIREMENTS

Superseded date

01-11-2005

Superseded by

EN 62258-1:2010

Published date

12-01-2013

Publisher

European Committee for Standards - Electrical

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Defines requirements for exchanging data concerning bare semiconductor die, with or without connection structures, and minimally-packaged semiconductor die. In addition, provides recommendations for general industry good practice in using bare die, with or without connection structures, and minimally-packaged die.

Committee
BTTF 97-1
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Superseded
SupersededBy

Standards Relationship
SN ES 59008-1 : 1999 Identical
PD ES 59008-1:2000 Identical

I.S. EN 61360-4:2005 STANDARD DATA ELEMENT TYPES WITH ASSOCIATED CLASSIFICATION SCHEME FOR ELECTRIC COMPONENTS - PART 4: IEC REFERENCE COLLECTION OF STANDARD DATA ELEMENT TYPES AND COMPONENT CLASSES
ES 59008-3 : 1999 DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 3 - MECHANICAL, MATERIAL AND CONNECTIVITY REQUIREMENTS
ES 59008-5-1 : 2001 DATA REQUIREMENTS FOR SEMI-CONDUCTOR DIE - PARTICULAR REQUIREMENTS AND RECOMMENDATIONS FOR DIE TYPES - BARE DIE
EN 61360-4:2005/corrigendum:2005 STANDARD DATA ELEMENT TYPES WITH ASSOCIATED CLASSIFICATION SCHEME FOR ELECTRIC COMPONENTS - PART 4: IEC REFERENCE COLLECTION OF STANDARD DATA ELEMENT TYPES AND COMPONENT CLASSES
ES 59008-2 : 1999 DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 2 - VOCABULARY
ES 59008-4-2 : 2000 DATA REQUIREMENTS FOR SEMICONDUCTOR DIE : SPECIFIC REQUIREMENTS AND RECOMMENDATIONS HANDLING AND STORAGE
PD ES 59008-3:1999 Data requirements for semiconductor die Mechanical, material and connectivity requirements
BS PD ES 59008-4.3 : 2000 DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 4-3: SPECIFIC REQUIREMENTS AND RECOMMENDATIONS - THERMAL
ES 59008-4-3 : 1999 DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 4-3 - SPECIFIC REQUIREMENTS AND RECOMMENDATIONS - THERMAL
BS PD ES 59008-5.1 : 2001 DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 5-1: PARTICULAR REQUIREMENTS AND RECOMMENDATIONS FOR DIE TYPES - BARE DIE
BS EN 61360-4:2005 Standard data element types with associated classification scheme for electric components IEC reference collection of standard data element types and component classes
BS PD ES 59008-4.2 : 2001 DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 4-2: SPECIFIC REQUIREMENTS AND RECOMMENDATIONS - HANDLING AND STORAGE
ES 59008-4-1 : 2000 DATA REQUIREMENTS FOR SEMI-CONDUCTOR DIE - SPECIFIC REQUIREMENTS AND RECOMMENDATIONS - TEST AND QUALITY
ES 59008-6-1 : 1999 DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 6-1 - EXCHANGE DATA FORMATS AND DATA DICTIONARY - DATA EXCHANGE - DDX FILE FORMAT
ES 59008-4-4 : 1999 DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 4-4: SPECIFIC REQUIREMENTS AND RECOMMENDATIONS - ELECTRICAL SIMULATION
BS PD ES 59008-6.1 : 1999 DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 6-1 - EXCHANGE DATA FORMATS AND DATA DICTIONARY - DATA EXCHANGE - DDX FILE FORMAT
BS PD ES 59008-6.2 : 2001 DATA REQUIREMENTS FOR SEMI-CONDUCTOR DIE - DATA DICTIONARY
PD ES 59008-1:2000 Data requirements for semiconductor die General requirements
PD ES 59008-5-3:2001 Data requirements for semiconductor die. Particular requirements and recommendations for die types Minimally-packaged die
PD ES 59008-2:1999 Data requirements for semiconductor die Vocabulary
I.S. ES 59008-5-3:2002 DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 5-3: PARTICULAR REQUIREMENTS AND RECOMMENDATIONS FOR DIE TYPES - MINIMALLY-PACKAGED DIE
ES 59008-6-2 : 2001 DATA REQUIREMENTS FOR SEMI CONDUCTOR DIE - DATA DICTIONARY
BS PD ES 59008-4.1 : 2001 DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 4-1: SPECIFIC REQUIREMENTS AND RECOMMENDATIONS - TEST AND QUALITY
IEC 61360-4:2005 Standard data element types with associated classification scheme for electric components - Part 4: IEC reference collection of standard data element types and component classes
ES 59008-5-3 : 2001 DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 5-3: PARTICULAR REQUIREMENTS AND RECOMMENDATIONS FOR DIE TYPES - MINIMALLY-PACKAGED DIE
ES 59008-5-2 : 2001 DATA REQUIREMENTS FOR SEMI-CONDUCTOR DIE - PART 5-2: PARTICULAR REQUIREMENTS AND RECOMMENDATIONS FOR DIE TYPES - BARE DIE WITH ADDED CONNECTION STRUCTURES
BS PD ES 59008-5.2 : 2001 DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 5-2: PARTICULAR REQUIREMENTS AND RECOMMENDATIONS FOR DIE TYPES - BARE DIE WITH ADDED CONNECTION STRUCTURES
BS PD ES 59008-4.4 : 2000 DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 4-4 - SPECIFIC REQUIREMENTS AND RECOMMENDATIONS - ELECTRICAL SIMULATION

ES 59008-6-2 : 2001 DATA REQUIREMENTS FOR SEMI CONDUCTOR DIE - DATA DICTIONARY
ES 59008-4-1 : 2000 DATA REQUIREMENTS FOR SEMI-CONDUCTOR DIE - SPECIFIC REQUIREMENTS AND RECOMMENDATIONS - TEST AND QUALITY
ES 59008-6-1 : 1999 DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 6-1 - EXCHANGE DATA FORMATS AND DATA DICTIONARY - DATA EXCHANGE - DDX FILE FORMAT
ES 59008-5-2 : 2001 DATA REQUIREMENTS FOR SEMI-CONDUCTOR DIE - PART 5-2: PARTICULAR REQUIREMENTS AND RECOMMENDATIONS FOR DIE TYPES - BARE DIE WITH ADDED CONNECTION STRUCTURES
ES 59008-3 : 1999 DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 3 - MECHANICAL, MATERIAL AND CONNECTIVITY REQUIREMENTS
ES 59008-2 : 1999 DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 2 - VOCABULARY
ES 59008-4-3 : 1999 DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 4-3 - SPECIFIC REQUIREMENTS AND RECOMMENDATIONS - THERMAL
ES 59008-5-1 : 2001 DATA REQUIREMENTS FOR SEMI-CONDUCTOR DIE - PARTICULAR REQUIREMENTS AND RECOMMENDATIONS FOR DIE TYPES - BARE DIE
ES 59008-4-4 : 1999 DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 4-4: SPECIFIC REQUIREMENTS AND RECOMMENDATIONS - ELECTRICAL SIMULATION
ES 59008-4-2 : 2000 DATA REQUIREMENTS FOR SEMICONDUCTOR DIE : SPECIFIC REQUIREMENTS AND RECOMMENDATIONS HANDLING AND STORAGE
ES 59008-5-3 : 2001 DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 5-3: PARTICULAR REQUIREMENTS AND RECOMMENDATIONS FOR DIE TYPES - MINIMALLY-PACKAGED DIE

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