GEIA STD 0006 : 2008
Current
The latest, up-to-date edition.
REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS
Hardcopy , PDF
English
01-01-2008
1. SCOPE
2. REFERENCES
3. DEFINITIONS AND ACRONYMS
4. TYPES AND CATEGORIES
5. GENERAL REQUIREMENTS
6. DOCUMENTATION
7. EQUIPMENT, TOOLS, AND MATERIALS
8. OVERALL PROCESS FLOW
9. PROCESS QUALIFICATION
10. PRODUCTION LOT TEST REQUIREMENTS
11. TEST METHODS
12. NOTES
ADDENDUM A - REQUIREMENTS FOR SERVICE FORM
ADDENDUM B - PROCESS COMPLIANCE MATRIX
Describes the requirements for fully replacing undesirable surface finishes using robotic hot solder dip.
| Committee |
G-24
|
| DocumentType |
Standard
|
| Pages |
26
|
| PublisherName |
Government Electronics & Information Technology Association
|
| Status |
Current
|
| IEC 62056-4-7:2015 | Electricity metering data exchange - The DLMS/COSEM suite - Part 4-7: DLMS/COSEM transport layer for IP networks |
| MIL-PRF-32565 Revision A:2017 | Battery, Rechargeable, Sealed, 6T Lithium-Ion |
| IEC TS 62647-21:2013 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics |
| GEIA HB 0005-1 : 2006 | PROGRAM MANAGEMENT/SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS |
| GEIA HB 0005-2 : 2007 | TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
| NASA MSFC STD 3012 : 2012 | ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL (EEE) PARTS MANAGEMENT AND CONTROL REQUIREMENTS FOR MSFC SPACE FLIGHT HARDWARE |
| NASA JSC 66491 : 2013 | STANDARD FOR JSC LEAD-FREE CONTROL PLANS (LFCP) |
| PD IEC/TS 62647-21:2013 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Program management. Systems engineering guidelines for managing the transition to lead-free electronics |
| PD IEC/TS 62647-2:2012 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Mitigation of deleterious effects of tin |
| IEC TS 62647-22:2013 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
| IEC PAS 62647-22:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
| IEC TS 62647-2:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin |
| PD IEC/TS 62647-22:2013 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines |
| MIL-STD-883 Revision K:2016 | Microcircuits |
| MIL-PRF-19500 Revision P:2010 | Semiconductor Devices, General Specification for |
| MIL-PRF-38534 Revision J:2015 | Hybrid Microcircuits, General Specification for |
| GEIA STD 0005-2 : 2012 | MITIGATING THE EFFECTS OF TIN WHISKERS IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
| ANSI/NCSL Z540 1 : 94(R2002) | CALIBRATION - CALIBRATION LABORATORIES AND MEASURING AND TEST EQUIPMENT - GENERAL REQUIREMENTS |
| ISO 10012:2003 | Measurement management systems — Requirements for measurement processes and measuring equipment |
| MIL-PRF-38535 Revision K:2013 | Integrated Circuits (Microcircuits) Manufacturing, General Specification for |
| FED-STD-595 Revision C:2008 | Colors Used in Government Procurement (S/S By SAE-AMS-STD-595) |
Access your standards online with a subscription
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.