Skip to content
Please enter a keyword to search

  • NASA JSC 66491 : 2013

    Current The latest, up-to-date edition.

    STANDARD FOR JSC LEAD-FREE CONTROL PLANS (LFCP)

    Available format(s): 

    Language(s): 

    Published date:  01-01-2013

    Publisher:  National Aeronautics and Space Administration

    Sorry this product is not available in your region.

    Add To Cart

    Table of Contents - (Show below) - (Hide below)

    1 GENERAL REQUIREMENTS
    2 APPLICABLE DOCUMENTS
    3 LEAD-FREE CONTROL PLAN (LFCP)
    4 ACRONYMS AND ABBREVIATIONS AND GLOSSARY OF TERMS

    Abstract - (Show below) - (Hide below)

    Describes requirements for the control and mitigation of performance and reliability risks associated with the use of Lead-free Tin (Sn) and Lead-free Tin (Sn) technology in flight hardware, mission essential support equipment, and elements thereof.

    General Product Information - (Show below) - (Hide below)

    Document Type Standard
    Publisher National Aeronautics and Space Administration
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC J STD 609 : A MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES
    GEIA HB 0005-2 : 2007 TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
    MIL-D-3464 Revision E:1987 DESICCANTS, ACTIVATED, BAGGED, PACKAGING USE AND STATIC DEHUMIDIFICATION
    NASA STD 8739.1 : 2016 WORKMANSHIP STANDARD FOR POLYMERIC APPLICATION ON ELECTRONIC ASSEMBLIES
    NASA STD 8739.3 : 1998 SOLDERED ELECTRICAL CONNECTIONS
    IPC J STD 001 : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    NASA STD 8739.2 : 1999 WORKMANSHIP STANDARD FOR SURFACE MOUNT TECHNOLOGY
    MIL-STD-2073-1 Revision E:2008 STANDARD PRACTICE FOR MILITARY PACKAGING
    IPC J STD 033C-1:2014 HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
    GEIA HB 0005-3 : 2008 REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
    MIL-HDBK-338 Revision B:1998 ELECTRONIC RELIABILITY DESIGN HANDBOOK
    GEIA STD 0005-2 : 2012 MITIGATING THE EFFECTS OF TIN WHISKERS IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
    GEIA HB 0005-1 : 2006 PROGRAM MANAGEMENT/SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS
    IPC 1601 : 0 PRINTED BOARD HANDLING AND STORAGE GUIDELINES
    NASA JSC 27301 : 2009 MATERIALS AND PROCESSES SELECTION, CONTROL, AND IMPLEMENTATION PLAN FOR JSC FLIGHT HARDWARE
    GEIA STD 0005-1 : 2012 PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
    GEIA STD 0006 : 2008 REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS
    IPC QL 653 : A Certification of Facilities that Inspect/Test Printed Boards, Components & Materials
    GEIA STD 0003 : 2006 LONG TERM STORAGE OF ELECTRONIC DEVICES
    NASA STD 8709.20 : 2010
    View more information

    • Access your standards online with a subscription

      Features

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective