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I.S. EN 60191-6-1:2002

Current

Current

The latest, up-to-date edition.

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES DESIGN GUIDE FOR GULL-WING LEAD TERMINALS

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2002

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.


Dates of withdrawal of national standards are available from NSAI.

€33.00
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FOREWORD
1 Scope
2 Normative references
3 Definitions
4 References and drawings
5 Outline dimensions
6 Package height and stand-off height
7 Terminal thickness and width
8 Terminal shape
9 Tolerance of terminal center position and coplanarity
Annex ZA (normative) Normative references to
         international publications with their
         corresponding European publications

Provides the requirements for the design rule of terminal shape plastic packages with gull-wing leads; QFP, SOP, SSOP, TSOP, etc. which are packages classified as Form E in IEC 60191-4.

DevelopmentNote
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType
Standard
Pages
16
PublisherName
National Standards Authority of Ireland
Status
Current

Standards Relationship
IEC 60191-6-1:2001 Identical
NF EN 60191-6-1 : 2002 Identical
EN 60191-6-1:2001 Identical
BS EN 60191-6-1:2001 Identical
UNE-EN 60191-6-1:2002 Identical
DIN EN 60191-6-1:2002-08 Identical

IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

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