I.S. EN 60191-6-1:2002
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES DESIGN GUIDE FOR GULL-WING LEAD TERMINALS
Hardcopy , PDF
English
01-01-2002
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
FOREWORD
1 Scope
2 Normative references
3 Definitions
4 References and drawings
5 Outline dimensions
6 Package height and stand-off height
7 Terminal thickness and width
8 Terminal shape
9 Tolerance of terminal center position and coplanarity
Annex ZA (normative) Normative references to
international publications with their
corresponding European publications
Provides the requirements for the design rule of terminal shape plastic packages with gull-wing leads; QFP, SOP, SSOP, TSOP, etc. which are packages classified as Form E in IEC 60191-4.
DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
DocumentType |
Standard
|
Pages |
16
|
PublisherName |
National Standards Authority of Ireland
|
Status |
Current
|
Standards | Relationship |
IEC 60191-6-1:2001 | Identical |
NF EN 60191-6-1 : 2002 | Identical |
EN 60191-6-1:2001 | Identical |
BS EN 60191-6-1:2001 | Identical |
UNE-EN 60191-6-1:2002 | Identical |
DIN EN 60191-6-1:2002-08 | Identical |
IEC 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
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