I.S. EN 60191-6-19:2010
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-19: MEASUREMENT METHODS OF THE PACKAGE WARPAGE AT ELEVATED TEMPERATURE AND THE MAXIMUM PERMISSIBLE WARPAGE
Hardcopy , PDF
English
01-01-2010
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Sample
5 Measurement
6 Maximum permissible package warpage at elevated temperature
7 Recommended datasheet for the package warpage
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
Describes measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA).
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
18
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| EN 60191-6-19:2010 | Identical |
| IEC 60191-6-19:2010 | Identical |
| IEC 60749-20:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| EN 60191-6-2:2002 | Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages |
| IEC 60191-6-5:2001 | Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) |
| IEC 60191-6-2:2001 | Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages |
| EN 60749-20:2009 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| EN 60191-6-5:2001 | Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) |
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