I.S. EN 60191-6-3:2001
Current
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-3: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF QUAD FLAT PACKS (QFP)
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-01-2001
Publisher
€53.00
Excluding VAT
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
Provides a method for quad flat packs measuring dimensions which are classified into Form E.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
24
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| DIN EN 60191-6-3:2001-06 | Identical |
| EN 60191-6-3:2000 | Identical |
| NF EN 60191-6-3 : 2001 | Identical |
| IEC 60191-6-3:2000 | Identical |
| BS EN 60191-6-3:2001 | Identical |
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