I.S. EN 60191-6-4:2003
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-4: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF BALL GRID ARRAY (BGA)
Hardcopy , PDF
English
01-01-2003
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
Important note : Users cannot be edited or removed once added to your Multi user PDF.
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Reference character and drawings
4.1 Ball grid array package (BGA) Type 1 - Ball datum
4.2 Ball grid array package (BGA) Type 2 - Body datum
5 Measuring method
5.1 Datum S pertaining to ball coplanarity
5.2 Datum A, B
5.3 Definition of specified dimensions and measuring
method
5.4 Profile of a package edge surface v
5.5 Mounting height A
5.6 First stand-off A1
5.7 Second stand-off A4
5.8 Ball diameter b
5.9 Ball center position X
5.10 Ball coplanarity y
5.11 Package top flatness y1
Annex ZA: Normative references to international publications
with their corresponding European publications
Includes requirements for the measuring methods of ball grid array (BGA) dimensions.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
28
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| IEC 60191-6-4:2003 | Identical |
| BS EN 60191-6-4:2003 | Identical |
| NF EN 60191-6-4 : 2003 | Identical |
| DIN EN 60191-6-4:2004-01 | Identical |
| NBN EN 60191-6-4 : 2004 | Identical |
| SN EN 60191-6-4 : 2003 | Identical |
| EN 60191-6-4:2003 | Identical |
| IEC 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.