I.S. EN 60749:1944
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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SEMICONDUCTOR DEVICES MECHANICAL AND CLIMATIC TEST METHODS
Hardcopy , PDF
22-08-2003
I.S. EN 60749-1:2003
I.S. EN 60749-13:2002
I.S. EN 60749-9:2017
I.S. EN 60749-12:2002
I.S. EN 60749-10:2002
I.S. EN 60749-11:2002
English
01-01-1944
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
Chapter 1: General
1 Scope and object
2 Normative references
3 Terms, definitions and letter symbols
4 Standard atmospheric conditions
5 External visual examination and verification of dimensions
6 Electrical measurements
Chapter 2: Mechanical test methods
1 Robustness of terminations
1.1 Tensile
1.2 Bending
1.3 Torsion
1.4 Torque
2 Soldering
2.1 Solderability
2.2 Resistance to soldering heat
2.3 Resistance of plastic encapsulated SMDs to the
combined effect of moisture and soldering heat
3 Vibration (sinusoidal)
4 Shock
5 Acceleration, steady state
6 Bond strength test
6.1 General
6.2 Methods A and B
6.3 Method C
6.4 Method D
6.5 Methods E and F
6.6 Method G: Wire ball shear test
6.7 Information to be given in the relevant specification
7 Die shear strength test
7.1 Object
7.2 Description of the test apparatus
7.3 Test method
7.4 Failure criteria
7.5 Requirements
7.6 Information to be given in the relevant
specification
Chapter 3: Climatic Test Methods
1 Change of temperature
1.1 Rapid change of temperature: two-chamber method
1.2 Rapid change of temperature: two-fluid-bath method
2 Storage (at high temperature)
3 Low air pressure
4A Damp heat, steady state
4B Damp heat, steady state, accelerated
4C Damp heat, steady state, highly accelerated
5 Sealing
5.1 General terms
5.2 Bomb pressure test
5.3 Fine leak detection: radioactive krypton method
5.4 Fine leak detection: tracer gas method with mass spectrometer
5.5 Gross leak, perfluorocarbon vapour method using electronic
detection apparatus
5.6 Gross leak - perfluorocarbon - bubble detection method
5.7 Test condition E, weight-gain gross-leak detection
5.8 Penetrant dye gross leak detection
5.9 Gross leak re-tests
6 Salt mist
7 Thermal intermittence test
8 Internal moisture content measurement by mass
spectrometry method
8.1 Object
8.2 General description
8.3 Test apparatus
8.4 Preconditioning
8.5 Conditioning
8.6 Requirements
8.7 Information to be given in the relevant specification
8.8 Guidance
Chapter 4: Miscellaneous Test Methods
1 Flammability tests of plastic-encapsulated devices
1.1 Flammability (internally induced)
1.2 Flammability (externally induced)
2 Permanence of marking
Annex A (normative) Guidance
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Defines test methods to semiconductor devices (discrete devices and integrated circuits) from which a selection may be made. Additional test methods may be required for non-cavity devices.
DocumentType |
Standard
|
Pages |
54
|
PublisherName |
National Standards Authority of Ireland
|
Status |
Superseded
|
SupersededBy |
Standards | Relationship |
BS EN 60749:1999 | Identical |
UNE EN 60749 : 2000 A2 2002 | Identical |
EN 60749 : 99 AMD 2 2001 | Identical |
IEC 60749:1996+AMD1:2000+AMD2:2001 CSV | Identical |
SN EN 60749 : 1999 AMD 1 2000 | Identical |
DIN EN 60749:2002-09 | Identical |
NF EN 60749 : 99 AMD 2 2002 | Identical |
NBN EN 60749 : 99 AMD 2 2002 | Identical |
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