I.S. EN 60749-25:2003
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 25: TEMPERATURE CYCLING
Hardcopy , PDF
English
01-01-2003
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test apparatus
5 Procedure
5.1 Initial measurements
5.2 Conditioning
5.3 Cycle rates
5.4 Upper and lower soak times
5.5 Upper and lower soak temperatures
5.6 Soak modes
5.7 Cycle time
5.8 Ramp rate
5.9 Load transfer time
5.10 Recovery
5.11 Final measurements
5.12 Failure criteria
6 Summary
Figure 1 - Representative temperature profile for
thermal cycle test conditions
Specifies a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
40
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| UNE-EN 60749-25:2004 | Identical |
| BS EN 60749-25:2003 | Identical |
| EN 60749-25:2003 | Identical |
| NF EN 60749-25 : 2003 | Identical |
| DIN EN 60749-25:2004-04 | Identical |
| SN EN 60749-25 : 2003 | Identical |
| NBN EN 60749-25 : 2004 | Identical |
| IEC 60749-25:2003 | Identical |
| IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
| EN 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
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