I.S. EN 60749-35:2006
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 35: ACOUSTIC MICROSCOPY FOR PLASTIC ENCAPSULATED ELECTRONIC COMPONENTS
Hardcopy , PDF
English
01-01-2006
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
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FOREWORD
1 Scope
2 Terms and definitions
3 Test apparatus
3.1 Reflective acoustic microscope system
3.2 Through transmission acoustic microscope system
3.3 Reference packages or standards
3.4 Sample holder
4 Procedure
4.1 General
4.2 Equipment setup
4.3 Performance of acoustic scans
Annex A (informative) Acoustic microscopy check sheet (example
only - not a mandatory template)
Annex B (informative) Potential image pitfalls
Annex C (informative) Some limitations of acoustic microscopy
Annex D (informative) Reference checklist for presenting
applicable scanned data
Bibliography
Describes the procedures for performing acoustic microscopy on plastic encapsulated electronic components. It provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
56
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| NBN EN 60749-35 : 2007 | Identical |
| BS EN 60749-35:2006 | Identical |
| EN 60749-35:2006 | Identical |
| DIN EN 60749-35:2007-03 | Identical |
| IEC 60749-35:2006 | Identical |
| NF EN 60749-35 : 2006 | Identical |
| IEC 60749-20:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
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