• There are no items in your cart

I.S. EN 60749-35:2006

Current

Current

The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 35: ACOUSTIC MICROSCOPY FOR PLASTIC ENCAPSULATED ELECTRONIC COMPONENTS

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2006

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.


Dates of withdrawal of national standards are available from NSAI.

FOREWORD
1 Scope
2 Terms and definitions
3 Test apparatus
  3.1 Reflective acoustic microscope system
  3.2 Through transmission acoustic microscope system
  3.3 Reference packages or standards
  3.4 Sample holder
4 Procedure
  4.1 General
  4.2 Equipment setup
  4.3 Performance of acoustic scans
Annex A (informative) Acoustic microscopy check sheet (example
        only - not a mandatory template)
Annex B (informative) Potential image pitfalls
Annex C (informative) Some limitations of acoustic microscopy
Annex D (informative) Reference checklist for presenting
        applicable scanned data
Bibliography

Describes the procedures for performing acoustic microscopy on plastic encapsulated electronic components. It provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.

DevelopmentNote
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType
Standard
Pages
56
PublisherName
National Standards Authority of Ireland
Status
Current

Standards Relationship
NBN EN 60749-35 : 2007 Identical
BS EN 60749-35:2006 Identical
EN 60749-35:2006 Identical
DIN EN 60749-35:2007-03 Identical
IEC 60749-35:2006 Identical
NF EN 60749-35 : 2006 Identical

IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

View more information
€80.00
Excluding VAT

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.