I.S. EN 61249-3-5:1999
Current
The latest, up-to-date edition.
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 3-5: SECTIONAL SPECIFICATION SET FOR UNREINFORCED BASE MATERIALS, CLAD AND UNCLAD (INTENDED FOR FLEXIBLE PRINTED BOARDS) - TRANSFER ADHESIVE FILMS
Hardcopy , PDF
English
01-01-1999
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
Important note : Users cannot be edited or removed once added to your Multi user PDF.
FOREWORD
1 Scope
2 Normative references
3 Materials and construction
4 Internal marking
5 Designation
6 Properties of adhesive films
7 Dimensions and tolerances
8 Packaging and marking
9 Acceptance testing
Annex A (informative) Conversion table for test method
reference numbers
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Covers requirements for transfer adhesive films for use in the fabrication of flexible multilayer boards or flex-rigid printed boards.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
24
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| BS EN 61249-3-5:1999 | Identical |
| UNE-EN 61249-3-5:2000 | Identical |
| NF EN 61249-3-5 : 2002 | Identical |
| EN 61249-3-5:1999 | Identical |
| IEC 61249-3-5:1999 | Identical |
| DIN EN 61249-3-5:1999-11 | Identical |
| SN EN 61249-3-5 : 1999 | Identical |
| EN 60249-2-15 : 1994 AMD 1 1994 | BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 15: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, OF DEFINED FLAMMABILITY |
| EN 60249-2-8 : 1994 COR 1994 | BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 8: FLEXIBLE COPPER-CLAD POLYESTER (PETP) FILM |
| IEC 60249-2-8:1987 | Base materials for printed circuits. Part 2: Specifications. Specification No. 8: Flexible copper-clad polyester (PETP) film |
| EN 60249-1 : 1993 COR 1994 | BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: TEST METHODS |
| EN 60249-2-13 : 1994 AMD 1 1994 | BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 13: FLEXIBLE COPPER CLAD POLYIMIDE FILM, GENERAL PURPOSE GRADE |
| IEC 60249-2-15:1987 | Base materials for printed circuits. Part 2: Specifications. Specification No. 15: Flexible copper-clad polyimide film, of defined flammability |
| IEC 60249-2-13:1987 | Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade |
| IEC 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
| EN 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.