I.S. EN 62047-25:2016
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 25: SILICON BASED MEMS FABRICATION TECHNOLOGY - MEASUREMENT METHOD OF PULL-PRESS AND SHEARING STRENGTH OF MICRO BONDING AREA
Hardcopy , PDF
English
01-01-2016
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National Foreword
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Requirements
5 Testing method
Annex A (informative) - Dimensions for testing
structure and tensile/compressive strength
Annex B (informative) - Pull-press testing method
example
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Defines the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based micro-electromechanical system (MEMS).
| DocumentType |
Standard
|
| Pages |
60
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| EN 62047-1:2016 | Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions |
| IEC 62047-1:2016 | Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions |
| ISO 10012:2003 | Measurement management systems — Requirements for measurement processes and measuring equipment |
| EN ISO 10012:2003 | Measurement management systems - Requirements for measurement processes and measuring equipment (ISO 10012:2003) |
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