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SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 9: WAFER TO WAFER BONDING STRENGTH MEASUREMENT FOR MEMS
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Available format(s): Hardcopy, PDF
Language(s): English
Published date: 01-01-2011
Publisher: National Standards Authority of Ireland
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.Only cited Standards give presumption of conformance to New Approach Directives/Regulations.Dates of withdrawal of national standards are available from NSAI.
FOREWORD1 Scope2 Normative references3 Measurement methodsAnnex A (informative) - Example of bonding forceAnnex B (informative) - An example of the fabrication process for three-point bending specimensBibliographyAnnex ZA (normative) - Normative references to international publications with their corresponding European publications
Specifies bonding strength measurement method of wafer to wafer bonding, type of bonding process such as silicon to silicon fusion bonding, silicon to glass anodic bonding, etc., and applicable structure size during MEMS processing/assembly.
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