I.S. EN 62137-1-5:2009
Current
The latest, up-to-date edition.
SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINTS - PART 1-5: MECHANICAL SHEAR FATIGUE TEST
Hardcopy , PDF
English
01-01-2009
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Test equipment and materials
5 Mounting
6 Test conditions
7 Items to be included in the test report
8 Items to be given in the product specification
Annex A (normative) - Mechanical shear fatigue test
equipment
Annex B (normative) - Mechanical shear fatigue test
procedure
Annex C (informative) - Evaluation of mechanical properties
of a single solder joint by mechanical shear fatigue
test
Bibliography
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
Describes a test method that applies to area array packages, such as BGA.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
29
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| EN 62137-1-5:2009 | Identical |
| IEC 62137-1-5:2009 | Identical |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| EN 61188-5-8:2008 | Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) |
| IEC 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| IEC 61249-2-7:2002 | Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad |
| IEC 61188-5-8:2007 | Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) |
| IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| EN 60068-1:2014 | Environmental testing - Part 1: General and guidance |
| EN 61760-1:2006 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
| IEC 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
| EN 61249-2-7:2002/corrigendum:2005 | MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
| EN 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| EN 61190-1-3:2007/A1:2010 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
| EN 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| EN 60194:2006 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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