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I.S. EN 62258-6:2006

Current

Current

The latest, up-to-date edition.

SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2006

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.


Dates of withdrawal of national standards are available from NSAI.

€33.00
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General
5 Requirements for information for thermal simulation
  5.1 Requirements for bare die with or without added connection
      structures
  5.2 Requirements for minimally-packaged die
  5.3 Information on thermal simulation model
Annex ZA (normative) Normative references to international
         Publications with their corresponding European
         publications
Bibliography

Ascertains the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die.

DevelopmentNote
Supersedes I.S. ES 59008-4-3. (11/2006) For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType
Standard
Pages
22
PublisherName
National Standards Authority of Ireland
Status
Current

Standards Relationship
IEC 62258-6:2006 Identical
NBN EN 62258-6 : 2007 Identical
EN 62258-6 : 2006 Identical
DIN EN 62258-6:2007-02 Identical
NF EN 62258-6 : 2006 Identical
BS EN 62258-6:2006 Identical

EN 62258-2:2011 SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS
IEC 62258-1:2009 Semiconductor die products - Part 1: Procurement and use
EN 62258-1:2010 Semiconductor die products - Part 1: Procurement and use
IEC 62258-2:2011 Semiconductor die products - Part 2: Exchange data formats

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