I.S. EN IEC 61190-1-3:2018
Current
The latest, up-to-date edition.
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
Hardcopy , PDF
English
10-04-2018
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
National Foreword
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Classification
5 Requirements
6 Quality assurance provisions
7 Preparation for delivery - Preservation, packing and packaging
Annex A (informative) - Selection of various alloys
and fluxes for use in electronic soldering - General
information concerning IEC 61190-1-3
Annex B (normative) - Lead-free solder alloys
Annex C (informative) - Marking method of solder
designation for mounted board, used in
electronic equipment
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Describes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for 'special' electronic grade solders.
| DevelopmentNote |
Supersedes I.S. EN 61190-1-3. For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (04/2018)
|
| DocumentType |
Standard
|
| Pages |
0
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| EN IEC 61190-1-3:2018 | Identical |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Identical |
| IEC 61189-5-3:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies |
| IEC 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| EN 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| IEC 61189-5-2:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies |
| ISO 9454-2:1998 | Soft soldering fluxes — Classification and requirements — Part 2: Performance requirements |
| ISO 9454-1:2016 | Soft soldering fluxes — Classification and requirements — Part 1: Classification, labelling and packaging |
| EN 61189-5-4:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies |
| EN 61189-5-3:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies |
| IEC 61189-5-4:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies |
| IEC 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| ISO 9453:2014 | Soft solder alloys — Chemical compositions and forms |
| EN 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| ISO 1073-1:1976 | Alphanumeric character sets for optical recognition — Part 1: Character set OCR-A — Shapes and dimensions of the printed image |
| EN 61189-5-2:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies |
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