IEC 60454-3-1:1998+AMD1:2001 CSV
Current
The latest, up-to-date edition.
Pressure-sensitive adhesive tapes for electrical purposes - Part 3: Specifications for individual materials - Sheet 1: PVC film tapes with pressure-sensitive adhesive
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
19-12-2002
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FOREWORD
INTRODUCTION
1 General
2 Classification and designation
3 Prescriptions
3 Requirements
4 Test methods
5 Marking, labelling, and packaging
Tables
Contains the requirements for plasticized PVC film tapes with pressure-sensitive adhesive for products having thermal indices from 60 to 105 and minimum temperature ratings from 0°C to -33°C. This consolidated version consists of the second edition (1998) and its amendment 1 (2001). Therefore, no need to order amendment in addition to this publication.
| Committee |
TC 15
|
| DevelopmentNote |
Also numbered as BS EN 60454-3.1 (07/2002) Stability Date: 2023. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
15
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| NF EN 60454 3-1 : 1998 AMD 1 2010 | Identical |
| VDE 0340-3-1 : 2002 | Identical |
| VDE 0340-3-15 : 2002 | Identical |
| I.S. EN 60454-3-1:1999 | Identical |
| UTEC 26 142 : AMD 3 86 | Similar to |
| DIN EN 60454-3-1 : 2002 | Identical |
| SN EN 60454-3-1 : 1998 AMD 1 2001 | Identical |
| CEI 15-15 : 1ED 1980 | Identical |
| UNE-EN 60454-3-1:1999 | Identical |
| EN 60454-3-1:1998/A1:2001 | Identical |
| VDE 0340-3-14 : 2002 | Identical |
| NEN 10454-3-1 : 1977 | Similar to |
| UNE 21357-1:1977 | Identical |
| PN EN 60454-3-1 : 2002 | Identical |
| NEN EN IEC 60454-3-1 : 1998 AMD 1 2001 | Identical |
| I.S. EN 60664-3:2017 | INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION |
| IEC 60664-3:2016 RLV | Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution |
| EN 60664-3:2017 | Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution |
| 16/30336979 DC : 0 | BS EN 60664-3 - INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION |
| I.S. EN 61189-3:2008 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) |
| UNE-EN 60664-3:2004 | Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution |
| BS 6221-2:1991 | Printed wiring boards Methods of test |
| 09/30201707 DC : 0 | BS EN 60664-3+A1 ED.2 - INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION |
| IEC 61189-3:2007 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| BS EN 61189-3:2008 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards) |
| NF EN 60664-3 : 2017 | INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION |
| BS EN 60664-3:2017 | Insulation coordination for equipment within low-voltage systems Use of coating, potting or moulding for protection against pollution |
| IEC 60664-3:2016 | Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution |
| EN 61189-3:2008 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| IEC 60454-2:2007 | Pressure-sensitive adhesive tapes for electrical purposes - Part 2: Methods of test |
| IEC 60454-1:1992 | Specifications for pressure-sensitive adhesive tapes for electrical purposes - Part 1: General requirements |
| IEC 60426:2007 | Electrical insulating materials - Determination of electrolytic corrosion caused by insulating materials - Test methods |
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