IEC 60748-20-1:1994
Current
The latest, up-to-date edition.
Semiconductor devices - Integrated circuits - Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits - Section 1: Requirements for internal visual examination
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
01-03-1994
Important note : Users cannot be edited or removed once added to your Multi user PDF.The purpose of these examinations is to check the internal materials, construction and workmanship of film and hybrid integrated circuits (F and HFICs). These examinations will normally be used prior to tapping or encapsulation to detect and eliminate the F and HFICs with internal defects that could lead to device failure in normal application. Other acceptance criteria may be agreed upon with the purchaser or supplier, respectively.
| DevelopmentNote |
Also numbered as BS QC760001(1994) (08/2005) Stability Date: 2017. (10/2012)
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| DocumentType |
Standard
|
| Pages |
55
|
| PublisherName |
International Electrotechnical Committee
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| Status |
Current
|
| Supersedes |
| BS QC 760101:1997 | Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedures |
| BS QC 760200:1997 | Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures |
| BS QC 760100:1997 | Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures |
| BS QC 760201:1997 | Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures |
| IEC 60748-22:1997 | Semiconductor devices - Integrated circuits - Part 22: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures |
| IEC 61747-1:1998+AMD1:2003 CSV | Liquid crystal and solid-state display devices - Part 1: Generic specification |
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