IEC 60748-22-1:1997
Current
The latest, up-to-date edition.
Semiconductor devices - Integrated circuits - Part 22-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
10-04-1997
1 Characteristics and conditions of use
2 Recommended methods of mounting
3 Marking
4 Ordering information
5 Certified records of released lots
6 Additional information
7 Additional or increased severities or requirements
to those specified in the generic and/or sectional
specification
8 Inspection requirements (see tables 2 and 3 or 4
and 5)
9 Supplement - Tables of method B
Tables
1 Where a range of circuits
2 Method A - Groups A and B - Lot-by-lot
3a Method A - Group C - Periodic tests
3b Method A - Group D - Periodic tests
4a Method B - Group A - Lot-by-lot
4b Method B - Group B - Lot-by-lot
5a Method B - Group C - Periodic tests
5b Method B - Group D - Periodic tests
Committee |
TC 47/SC 47A
|
DevelopmentNote |
Also numbered as BS QC760201(1997). (09/2003) Supersedes IEC 60186B. (07/2004) Stability Date: 2020. (09/2017)
|
DocumentType |
Standard
|
Pages |
29
|
PublisherName |
International Electrotechnical Committee
|
Status |
Current
|
Supersedes |
Standards | Relationship |
NEN IEC 60748-22-1 : 1998 | Identical |
BS QC 760200:1997 | Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures |
BS QC 760200:1992 | Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for film integrated circuits and hybrid film integrated circuits: capability approval |
IEC 61747-1:1998+AMD1:2003 CSV | Liquid crystal and solid-state display devices - Part 1: Generic specification |
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