IEC 60749-1:2002
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 1: General
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
30-08-2002
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and letter symbols
4 Standard atmospheric conditions
5 Electrical measurements
6 Use of electrically defective devices
Applicable to semiconductor devices (discrete devices and integrated circuits) and establishes provisions common to all the other parts of the series.The contents of the corrigendum of August 2003 have been included in this copy.
| Committee |
TC 47
|
| DevelopmentNote |
Supersedes IEC 60749. (03/2008) Stability Date: 2021. (11/2017)
|
| DocumentType |
Standard
|
| Pages |
16
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| BS EN 60749-1:2003 | Identical |
| CEI EN 60749-1 : 2005 | Identical |
| EN 60749-1:2003 | Identical |
| DIN EN 60749-1:2003-12 | Identical |
| NF EN 60749-1 : 2003 | Identical |
| UNE-EN 60749-1:2004 | Identical |
| NEN EN IEC 60749-1 : 2003 | Identical |
| I.S. EN 60749-1:2003 | Identical |
| PN EN 60749-1 : 2005 | Identical |
| SN EN 60749-1 : 2003 | Identical |
| 13/30264591 DC : 0 | BS EN 60747-14-6 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-6: SEMICONDUCTOR SENSORS - HUMIDITY SENSOR |
| BS EN 62137-4:2014 | Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices |
| 07/30172404 DC : DRAFT DEC 2007 | BS EN 62047-9 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 9: WAFER TO WAFER BONDING STRENGTH MEASUREMENT FOR MEMS |
| EN 62137:2004/corrigendum:2005 | ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN |
| IEC 60747-14-4:2011 | Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers |
| BS IEC 60747-14-5:2010 | Semiconductor devices Semiconductor sensors. PN-junction semiconductor temperature sensor |
| 07/30170374 DC : DRAFT AUG 2007 | BS EN 61751-2 - LASER MODULES USED FOR TELECOMMUNICATIONS - RELIABILITY ASSESSMENT - PART 2: TECHNICAL REPORT ON LASER MODULE DEGRADATION |
| IEC 62137:2004 | Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN |
| BS EN 62137:2004 | Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN |
| 07/30162213 DC : 0 | BS EN 60747-15 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES |
| BS IEC 60747-14-4:2011 | Semiconductor devices. Discrete devices Semiconductor accelerometers |
| 07/30172155 DC : DRAFT OCT 2007 | BS EN 62047-5 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 5: RF MEMS SWITCHES |
| IEC 60747-14-5:2010 | Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor |
| IEC 62137-4:2014 | Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices |
| 13/30264600 DC : 0 | BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID |
| I.S. EN 62137:2005 | ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN |
| 07/30164953 DC : 0 | IEC 60747-14-5 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 14-5: SEMICONDUCTOR SENSORS - PN-JUNCTION SEMICONDUCTOR TEMPERATURE SENSOR |
| 12/30271778 DC : 0 | BS EN 62137-4 ED.1 - ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES |
| I.S. EN 62137-4:2014 | ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES |
| 13/30264596 DC : 0 | BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER |
| PD IEC/TR 62572-2:2008 | Fibre optic active components and devices. Reliability standards Laser module degradation |
| IEC TR 62572-2:2008 | Fibre optic active components and devices - Reliability standards - Part 2: Laser module degradation |
| EN 62137-4:2014/AC:2015 | ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES (IEC 62137-4:2014) |
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