IEC 60749-22:2002
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
12-09-2002
Important note : Users cannot be edited or removed once added to your Multi user PDF.
FOREWORD
INTRODUCTION
1 Scope and object
1.1 General description of the test
1.2 Description of the test apparatus (for all methods)
2 Methods A and B (see also annex A)
2.1 Scope
2.2 General description of the test
3 Method C
3.1 Scope
3.2 Method C: Bond peel
4 Method D
4.1 Scope
4.2 Method D: Bond shear (applied to flip chip)
5 Methods E and F
5.1 Scope
5.2 Method E: Push-off test
5.3 Method F: Pull-off test
5.4 Failure criteria for both methods E and F
5.5 Force to be applied (both methods)
6 Method G: Wire ball shear test
6.1 Scope
6.2 General description
6.3 Terms and definitions
6.4 Equipment and material
6.5 Procedure
6.6 Acceptable test limits
7 Information to be given in the relevant specification
Annex A (normative) Guidance
Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements.The contents of the corrigendum of August 2003 have been included in this copy.
| DevelopmentNote |
Supersedes IEC 60749. (03/2008) Stability Date: 2018. (11/2017)
|
| DocumentType |
Standard
|
| Pages |
41
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| NF EN 60749-22 : 2003 | Identical |
| NEN EN IEC 60749-22 : 2003 | Identical |
| I.S. EN 60749-22:2003 | Identical |
| PN EN 60749-22 : 2006 | Identical |
| SN EN 60749-22 : 2003 | Identical |
| UNE-EN 60749-22:2004 | Identical |
| BS EN 60749-22:2003 | Identical |
| CEI EN 60749-22 : 2004 | Identical |
| EN 60749-22:2003 | Identical |
| DIN EN 60749-22:2003-12 | Identical |
| EN 62435-5:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices |
| I.S. EN 62435-5:2017 | ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5: DIE AND WAFER DEVICES |
| 13/30264591 DC : 0 | BS EN 60747-14-6 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-6: SEMICONDUCTOR SENSORS - HUMIDITY SENSOR |
| 13/30264600 DC : 0 | BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID |
| IEC TS 62686-1:2015 | Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors |
| IEC 62435-5:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices |
| BS EN 62435-5:2017 | Electronic components. Long-term storage of electronic semiconductor devices Die and wafer devices |
| PD IEC/TS 62686-1:2015 | Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors |
| 13/30264596 DC : 0 | BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.