IEC 60749-37:2022
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
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English - French
12-10-2022
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IEC 60749-37:2022 provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test. This edition includes the following significant technical changes with respect to the previous edition:
- correction of a previous technical error concerning test conditions;
- updates to reflect improvements in technology.
| Committee |
TC 47
|
| DocumentType |
Standard
|
| Pages |
43
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| NF EN IEC 60749-37:2022 | Identical |
| CEI EN IEC 60749-37:2023 | Identical |
| PN-EN IEC 60749-37:2023-07 | Identical |
| DS/EN IEC 60749-37:2022 | Identical |
| OVE EN IEC 60749-37:2024 01 01 | Identical |
| SS-EN IEC 60749-37, UTG 2:2023 | Identical |
| UNE-EN IEC 60749-37:2022 | Identical |
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