IEC 60749-42:2014
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
12-08-2014
Important note : Users cannot be edited or removed once added to your Multi user PDF.
FOREWORD
1 Scope
2 Normative references
3 Test equipment
4 Procedure
5 Failure criteria
6 Information to be given in applicable
procurement document
IEC 60749-42:2014 provides a test method to evaluate the endurance of semiconductor devices used in high temperature and high humidity environments. This test method is used to evaluate the endurance against corrosion of the metallic interconnection of chips of semiconductor devices contained in plastic moulded and other types of packages. It is also used as a means of accelerating the leakage phenomena due to the moisture penetration through the passivation film and as a pre-conditioning for various kinds of tests.
| Committee |
TC 47
|
| DevelopmentNote |
Stability date: 2017. (08/2014)
|
| DocumentType |
Standard
|
| Pages |
16
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| SN EN 60749-42:2014 | Identical |
| NBN EN 60749-42 : 2014 | Identical |
| NEN EN IEC 60749-42 : 2014 | Identical |
| PN EN 60749-42 : 2014 | Identical |
| BS EN 60749-42:2014 | Identical |
| CEI EN 60749-42 : 2016 | Identical |
| EN 60749-42:2014 | Identical |
| DIN EN 60749-42:2015-05 | Identical |
| PNE-FprEN 60749-42 | Identical |
| UNE-EN 60749-42:2014 | Identical |
| BS EN 60749-43:2017 | Semiconductor devices - Mechanical and climatic test methods Guidelines for IC reliability qualification plans |
| EN 60749-43:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans |
| 15/30269562 DC : 0 | BS EN 60749-43 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR LSI RELIABILITY QUALIFICATION PLANS |
| CEI EN 60749-43 : 1ED 2018 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS |
| I.S. EN 60749-43:2017 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS |
| IEC 60749-43:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans |
| IEC 60749-20:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.