IEC 61188-1-2:1998
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance
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31-12-2021
English - French
29-04-1998
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1. Scope
2. Normative references
3. Engineering design overview
3.1 Device selection
3.2 Interconnection
3.3 Printed board and printed board assemblies
3.4 Performance requirements
3.5 Power distribution
4. Design of controlled impedance circuits
4.1 Configurations
4.2 Equations
4.3 Controlled impedance design rules
4.4 Cross-talk rules
4.5 Coupon design rules
4.6 Decoupling/capacitor rules
5. Design for manufacturing
5.1 Process rules in CAD
5.2 Design complexity and correlation to cost
6. Data description
6.1 Details of construction
6.2 Isolation of data by net class (noise, timing,
capacitance and impedance)
6.3 Electrical performance
7. Material
7.1 Resin systems
7.2 Reinforcements
7.3 Prepregs, bonding layers and adhesives
7.4 Frequency dependence
8. Fabrication
8.1 General
8.2 Preproduction processes
8.3 Production processes
8.4 Impact of defects at high frequencies
8.5 Data description
9. Time domain reflectrometry (TDR) testing
9.1 Rationale
Annex A - Units, symbols, and terminology
The aim in packaging is to transfer a signal from one device to one or more other devices through a conductor. High-speed designs are defined as designs in which the interconnecting properties affect circuit performance and require unique considerations.
| Committee |
TC 91
|
| DevelopmentNote |
Also numbered as BS EN 61188-1.2 (08/2004) Stability Date: 2017. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
83
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Withdrawn
|
| Standards | Relationship |
| NF EN 61188-1-2 : 2000 | Identical |
| GOST IEC 61188-1-2 : 2013 | Identical |
| NEN EN IEC 61188-1-2 : 1998 | Identical |
| PN EN 61188-1-2 : 2005 | Identical |
| SN EN 61188-1-2 : 1998 | Identical |
| UNE-EN 61188-1-2:1998 | Identical |
| CEI EN 61188-1-2 : 1999 | Identical |
| EN 61188-1-2:1998 | Identical |
| DIN EN 61188-1-2:1999-03 | Similar to |
| I.S. EN 61189-3:2008 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) |
| IEC 61189-3:2007 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| BS EN 61189-3:2008 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards) |
| EN 61189-3:2008 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| IEC 61182-7:1995 | Printed boards - Electronic data description and transfer - Part 7: Bare board electrical test information in digital form |
| IEC 61189-3:2007 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| IEC 61182-1:1994 | Printed boards - Electronic data description and transfer - Part 1: Printed board description in digital form |
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