IEC 61249-2-21:2003
Current
The latest, up-to-date edition.
Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
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English - French, Spanish, Castilian
12-11-2003
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FOREWORD
1 Scope
2 Normative references
3 Materials and construction
3.1 Resin system
3.2 Reinforcement
3.3 Metal foil
4 Internal marking
5 Electrical properties
6 Non-electrical properties of the copper-clad laminate
6.1 Appearance of the copper-clad sheet
6.2 Appearance of the unclad face
6.3 Laminate thickness
6.4 Bow and twist
6.5 Properties related to the copper foil bond
6.6 Punching and machining
6.7 Dimensional stability
6.8 Sheet sizes
6.9 Cut panels
7 Non-electrical properties of the base material after complete
removal of the copper foil
7.1 Appearance of the dielectric base material
7.2 Flexural strength
7.3 Flammability
7.4 Water absorption
7.5 Measling
7.6 Glass transition temperature and cure factor
8 Quality assurance
8.1 Quality system
8.2 Responsibility for inspection
8.3 Qualification inspection
8.4 Quality conformance inspection
8.5 Certificate of conformance
8.6 Safety data sheet
9 Packaging and marking
10 Ordering information
Annex A (informative) Engineering information
Annex B (informative) Common laminate constructions
Annex C (informative) Guideline for qualification and
conformance inspection
Bibliography
Tables
Gives requirements for properties of non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability, copper-clad in thicknesses 0,05 mm up to 3,2 mm. The flammability rating is achieved through the use of non-halogenated inorganic and/or organic compounds acting as fire retardants.
| Committee |
TC 91
|
| DevelopmentNote |
Stability Date: 2018. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
47
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| I.S. EN 61249-2-21:2004 | Identical |
| NEN EN IEC 61249-2-21 : 2004 | Identical |
| PN EN 61249-2-21 : 2009 | Identical |
| CEI EN 61249-2-21 : 2005 | Identical |
| EN 61249-2-21:2003 | Identical |
| NF EN 61249-2-21 : 2004 | Identical |
| DIN EN 61249-2-21:2004-06 | Identical |
| BS EN 61249-2-21:2003 | Identical |
| UNE-EN 61249-2-21:2005 | Identical |
| IEC PAS 63015:2016 | Definition of "Low-Halogen" for electronic products |
| IPC J STD 609 CHINESE : A | IPC/JEDEC MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES |
| ECMA 370 : 5ED 2015 | TED - THE ECO DECLARATION |
| IEC 60893-3-2:2003+AMD1:2011 CSV | Insulating materials - Industrial rigid laminated sheets based on thermosetting resins for electrical purposes - Part 3-2: Specifications for individual materials - Requirements for rigid laminated sheets based on epoxy resins |
| IEC TR 62474-1:2015 | Material declaration for products of and for the electrotechnical industry - Part 1: Guidance for the implementation of IEC 62474 |
| IPC J STD 609 : A | MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES |
| PD IEC/TR 62474-1:2015 | Material declaration for products of and for the electrotechnical industry Guidance for the implementation of IEC 62474 |
| IEC PAS 62588:2008 | Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes |
| DD IEC/PAS 62588:2008 | Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes |
| PD IEC/PAS 63015:2016 | Definition of “Low-Halogen” for electronic products |
| BS EN 60893-3-2 : 2004 | INSULATING MATERIALS - INDUSTRIAL RIGID LAMINATED SHEETS BASED ON THERMOSETTING RESINS FOR ELECTRICAL PURPOSES - PART 3-2: SPECIFICATIONS FOR INDIVIDUAL MATERIALS - REQUIREMENTS FOR RIGID LAMINATED SHEETS BASED ON EPOXY RESINS |
| 12/30262664 DC : DRAFT APR 2012 | BS EN 62588 - MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES |
| IEEE 1680.3-2012 | IEEE Standard for Environmental Assessment of Televisions |
| IEEE 1680.2-2012 | IEEE Standard for Environmental Assessment of Imaging Equipment |
| UNE-EN 60893-3-2:2004 | Insulating materials - Industrial rigid laminated sheets based on thermosetting resins for electrical purposes -- Part 3-2: Specifications for individual materials - Requirements for rigid laminated sheets based on epoxy resins |
| EN 60893-3-2:2004/A1:2011 | INSULATING MATERIALS - INDUSTRIAL RIGID LAMINATED SHEETS BASED ON THERMOSETTING RESINS FOR ELECTRICAL PURPOSES - PART 3-2: SPECIFICATIONS FOR INDIVIDUAL MATERIALS - REQUIREMENTS FOR RIGID LAMINATED SHEETS BASED ON EPOXY RESINS |
| ISO 11014-1:1994 | Safety data sheet for chemical products Part 1: Content and order of sections |
| IEC 61249-5-1:1995 | Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials) |
| ISO 14001:2015 | Environmental management systems — Requirements with guidance for use |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| ISO 9000:2015 | Quality management systems — Fundamentals and vocabulary |
| IEC 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
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