• PD IEC/PAS 63015:2016

    Current The latest, up-to-date edition.

    Definition of “Low-Halogen?? for electronic products

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  31-08-2016

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 Terms, definitions and abbreviated terms
    4 Requirements for low-halogen electronic products
    5 Compliance process for low-halogen electronic
      materials and components
    6 Marking and labeling for 'low-halogen'
      electronic products
    Annex A (informative) - Where BFRs, CFRs, and
            PVC are used in electronic or electrical
            products
    Annex B (informative) - Suggested test protocols
            - Low-halogen process flow
    Annex C (informative) - Clarification for including
            only bromine and chlorine in the definition
            of low-halogen materials
    Annex D (informative) - Differences between
            JS709B and JS709A
    Bibliography

    Abstract - (Show below) - (Hide below)

    Gives terms and definitions for 'low-halogen' electronic products that have the potential to contain the halogens bromine (Br) and chlorine (Cl) from the use of BFRs, CFRs, and PVC, and recommends methods for marking and labeling.

    Scope - (Show below) - (Hide below)

    This document provides terms and definitions for “low-halogen?? electronic products that have the potential to contain the halogens bromine (Br) and chlorine (Cl) from the use of BFRs, CFRs, and PVC, and recommends methods for marking and labeling. This standard may be applied to all nonmetallic and nonceramic materials within electronic products including, but not limited to, materials in the following components commonly found in electronic products:

    1. transistors, integrated circuits, modules consisting mainly of integrated circuits (e.g. multichip, hybrid), and memory modules;

    2. resistors, capacitors, relays, inductors, and connectors;

    3. printed circuit board assemblies (PCBAs) including components;

    4. plastic in cables, sockets, switches and external wiring;

    5. mechanical plastics (enclosures, fans, etc.);

    6. films, tapes, inks, and adhesives;

    7. soldering flux residues (when present);

    8. sound, shock, and vibration dampeners (foams, resins, etc.).

    This document establishes the maximum concentration level for the halogens bromine (Br) and chlorine (Cl) from the use of BFRs, CFRs, and PVC. While the halogen group contains fluorine, chlorine, bromine, iodine, and astatine, this document will use the term “low-halogen?? to refer only to bromine and chlorine. Refer to Annex C for further explanation for exclusion of astatine, iodine and fluorine.

    NOTE The definition of “low-halogen?? is different from the term “halogen-free?? as described in IEC 61249-2 sectional standard related to non-halogenated base material and as defined in the J-STD-609A marking and labeling standard; standards that pertain only to printed boards and are currently in use in the electronics and solid-state industries.

    BFRs, CFRs, and PVC in materials that may be used during processing, in product delivery systems, or in packaging, but do not remain within the final product are not included in the scope of this document.

    General Product Information - (Show below) - (Hide below)

    Committee GEL/111
    Document Type Standard
    Publisher British Standards Institution
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC J STD 609 : A MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES
    IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
    ISO 11469:2016 Plastics — Generic identification and marking of plastics products
    IEC 61249-2-26:2005 Materials for printed boards and other interconnecting structures - Part 2-26: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
    IPC WP/TR 584 : A IPC WHITE PAPER AND TECHNICAL REPORT ON THE USE OF HALOGENATED FLAME RETARDANTS IN PRINTED CIRCUIT BOARDS AND ASSEMBLIES
    EN 14582:2016 Characterization of waste - Halogen and sulfur content - Oxygen combustion in closed systems and determination methods
    IPC TM 650 : 0 TEST METHODS MANUAL
    IPC 4101 : D SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
    IEC 61249-2-21:2003 Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
    IEC 62321:2008 Electrotechnical products - Determination of levels of six regulated substances (lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls, polybrominated diphenyl ethers)
    IEC 61249-2-22:2005 Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad
    ISO 1043-4:1998 Plastics Symbols and abbreviated terms Part 4: Flame retardants
    IEC 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
    IEC 61249-2-23:2005 Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad
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