IEC 61249-2-34:2009
Current
The latest, up-to-date edition.
Materials for printed boards and other interconnecting structures - Part 2-34: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad
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English - French
11-02-2009
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FOREWORD
1 Scope
2 Normative references
3 Materials and construction
3.1 Resin system
3.2 Metal foil
3.3 Reinforcement
4 Internal marking
5 Electrical properties
6 Non-electrical properties of the copper-clad laminate
6.1 Appearance of the copper-clad sheet
6.1.1 Indentations (pits and dents)
6.1.2 Wrinkles
6.1.3 Scratches
6.1.4 Raised areas
6.1.5 Surface waviness
6.2 Appearance of the unclad face
6.3 Laminate thickness
6.4 Bow and twist
6.5 Properties related to the copper foil bond
6.6 Punching and machining
6.7 Dimensional stability
6.8 Sheet sizes
6.8.1 Typical sheet sizes
6.8.2 Tolerances for sheet sizes
6.9 Cut panels
6.9.1 Cut panel sizes
6.9.2 Size tolerances for cut panels
6.9.3 Rectangularity of cut panels
7 Non-electrical properties of the base material after
complete removal of the copper foil
7.1 Appearance of the dielectric base material
7.2 Flexural strength
7.3 Flammability
7.4 Water absorption
7.5 Measling
7.6 Glass transition temperature and cure factor
8 Quality assurance
8.1 Quality system
8.2 Responsibility for inspection
8.3 Qualification inspection
8.4 Quality conformance inspection
8.5 Certificate of conformance
8.6 Safety data sheet
9 Packaging and marking/labelling
10 Ordering information
Annex A (informative) - Engineering information
Annex B (informative) - Common laminate constructions
Annex C (informative) - Guideline for qualification and
conformance inspection
Bibliography
IEC 61249-2-34:2009 specifies requirements for properties of non-halogenated epoxide woven E-glass laminate sheet of a thickness of 0,05 mm up to 3,2 mm, of defined flammability (vertical burning test), copper-clad. The glass transition temperature is defined to be 150 °C minimum. The relative permittivity is equal to or less than 3,7 and the dissipation factor is equal to or less than 0,0070 at 1 GHz.
| Committee |
TC 91
|
| DevelopmentNote |
Stability Date: 2020. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
42
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NF EN 61249-2-34 : 2007 PR | Identical |
| EN 61193-3:2013 | Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing |
| I.S. EN 61193-3:2013 | QUALITY ASSESSMENT SYSTEMS - PART 3: SELECTION AND USE OF SAMPLING PLANS FOR PRINTED BOARD AND LAMINATE END-PRODUCT AND IN-PROCESS AUDITING (IEC 61193-3:2013 (EQV)) |
| BS EN 61193-3:2013 | Quality assessment systems Selection and use of sampling plans for printed board and laminate end-product and in-process auditing |
| IEC 61193-3:2013 | Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing |
| ISO 11014-1:1994 | Safety data sheet for chemical products Part 1: Content and order of sections |
| IEC 61249-5-1:1995 | Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials) |
| ISO 14001:2015 | Environmental management systems — Requirements with guidance for use |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| ISO 9000:2015 | Quality management systems — Fundamentals and vocabulary |
| IEC 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
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