IEC 61249-2-9:2003
Current
The latest, up-to-date edition.
Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials, clad and unclad - Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
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English - French, Spanish, Castilian
27-02-2003
FOREWORD
1 Scope
2 Normative references
3 Materials and construction
3.1 Resin system
3.2 Reinforcement
3.3 Metal foil
4 Internal marking
5 Electrical properties
6 Non-electrical properties of the copper-clad laminate
6.1 Appearance of the copper-clad sheet
6.2 Appearance of the unclad face
6.3 Laminate thickness
6.4 Bow and twist
6.5 Properties related to the copper foil bond
6.6 Punching and machining
6.7 Dimensional stability
6.8 Sheet sizes
6.9 Cut panels
7 Non-electrical properties of the base material after
complete removal of the copper foil
7.1 Appearance of the dielectric base material
7.2 Flexural strength
7.3 Flammability
7.4 Water absorption
7.5 Measling
7.6 Glass transition temperature and cure factor
8 Quality assurance
8.1 Quality system
8.2 Responsibility for inspection
8.3 Qualification inspection
8.4 Quality conformance inspection
8.5 Certificate of conformance
8.6 Safety data sheet
9 Packaging and marking
10 Ordering information
Annex A (informative) Engineering information
Annex B (informative) Common laminate constructions
Annex C (informative) Guideline for qualification and
conformance inspection
Bibliography
Tables
Gives requirements for properties of bismaleimide/triazine modified epoxide, or unmodified, woven E-glass reinforced laminate sheets of defined flammability, copper-clad in thicknesses of 0,05 mm to 3,2 mm. The flammability rating is achieved through the use of fire retardants contained as an integral part of the epoxide polymeric structure.
Committee |
TC 91
|
DevelopmentNote |
Stability Date: 2018. (09/2017)
|
DocumentType |
Standard
|
Pages |
45
|
PublisherName |
International Electrotechnical Committee
|
Status |
Current
|
Standards | Relationship |
NF EN 61249-2-9 : 2004 | Identical |
NEN EN IEC 61249-2-9 : 2003 | Identical |
UNE-EN 61249-2-9:2004 | Identical |
I.S. EN 61249-2-9:2003 | Identical |
PN EN 61249-2-9 : 2004 | Identical |
SN EN 61249-2-9 : 2003 | Identical |
BS EN 61249-2-9:2003 | Identical |
CEI EN 61249-2-9 : 2004 | Identical |
EN 61249-2-9:2003 | Identical |
DIN EN 61249-2-9:2004-01 | Identical |
BS EN 62326-4:1997 | Printed boards Rigid multilayer printed boards with interlayer connections. Sectional specification |
BS EN 62326-4-1:1997 | Printed boards. Rigid multilayer printed boards with interlayer connections. Sectional specification Capability detail specification. Performance levels, A, B and C |
ISO 11014-1:1994 | Safety data sheet for chemical products Part 1: Content and order of sections |
IEC 61249-5-1:1995 | Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials) |
ISO 14001:2015 | Environmental management systems — Requirements with guidance for use |
IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
ISO 9000:2015 | Quality management systems — Fundamentals and vocabulary |
IEC 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
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