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  • IEC 61249-8-7:1996

    Current The latest, up-to-date edition.

    Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English - French, Spanish, Castilian

    Published date:  26-04-1996

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    Clause
    1 Scope
    2 Normative references
    3 Requirements
       3.1 Storage properties
       3.2 Containers and their markings
       3.3 Adhesion (pressure sensitive tape method)
       3.4 Resistance to solvents, fluxes and soldering
       3.5 Degree of cure
       3.6 Abrasion resistance (pencil hardness)
       3.7 Flammability
       3.8 Thermal shock
       3.9 Solderability
       3.10 Environmental
    Annexes
    A Conversion table
    B Bibliography

    Abstract - (Show below) - (Hide below)

    Details requirements for the qualification of marking inks used forlegends and other identifications used on printed boards.Information in this specification will also provide guidanceregarding the suitability of printed boards which feature markinginks.

    General Product Information - (Show below) - (Hide below)

    Development Note Also numbered as BS EN 61249-8.7 (11/2005) Stability Date: 2018. (09/2017)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS EN 62326-4:1997 Printed boards Rigid multilayer printed boards with interlayer connections. Sectional specification
    BS EN 62326-4-1:1997 Printed boards. Rigid multilayer printed boards with interlayer connections. Sectional specification Capability detail specification. Performance levels, A, B and C

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    IEC 60068-2-38:2009 Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test
    IEC 60068-2-3:1969 Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state
    IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
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