Skip to content
Please enter a keyword to search

  • IEC 62047-1:2016

    Current The latest, up-to-date edition.

    Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English - French

    Published date:  06-01-2016

    Publisher:  International Electrotechnical Committee

    Add To Cart

    Abstract - (Show below) - (Hide below)

    IEC 62047-1:2016 defines terms for micro-electromechanical devices including the process of production of such devices. This edition includes the following significant technical changes with respect to the previous edition:
    a) removal of ten terms;
    b) revision of twelve terms;
    c) addition of sixteen new terms.

    General Product Information - (Show below) - (Hide below)

    Committee TC 47/SC 47F
    Development Note Stability Date: 2019. (01/2016)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    10/30211446 DC : 0 BS EN 62047-11 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 11: TEST METHOD FOR LINEAR THERMAL EXPANSION COEFFICIENTS OF MEMS MATERIALS
    BS EN 62047-25:2016 Semiconductor devices. Micro-electromechanical devices Silicon based MEMS fabrication technology. Measurement method of pull-press and shearing strength of micro bonding area
    I.S. EN 62047-4:2010 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 4: GENERIC SPECIFICATION FOR MEMS
    08/30172398 DC : DRAFT FEB 2008 BS EN 62047-8 - SEMICONDUCTOR DEVICES - MICRO - ELECTROMECHANICAL DEVICES - PART 8: STRIP BENDING TEST METHOD FOR TENSILE PROPERTY MEASUREMENT OF THIN FILMS
    CEI EN 60876-1 : 2015 FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS - FIBRE OPTIC SPATIAL SWITCHES - PART 1: GENERIC SPECIFICATION
    BS EN 62047-4:2010 Semiconductor devices. Micro-electromechanical devices Generic specification for MEMS
    BS IEC 60747-14.1 : 2010 SEMICONDUCTOR DEVICES - PART 14-1: SEMICONDUCTOR SENSORS - GENERIC SPECIFICATION FOR SENSORS
    10/30211442 DC : 0 BS EN 62047-10 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 10: MICROPILLAR COMPRESSION TEST FOR MEMS MATERIALS
    I.S. EN 62047-14:2012 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 14: FORMING LIMIT MEASURING METHOD OF METALLIC FILM MATERIALS (IEC 62047-14:2012 (EQV))
    BS EN 60876-1:2014 Fibre optic interconnecting devices and passive components. Fibre optic spatial switches Generic specification
    BS EN 62047-14:2012 Semiconductor devices. Micro-electromechanical devices Forming limit measuring method of metallic film materials
    05/30104054 DC : DRAFT APR 2005 IEC 62047-3 - SEMICONDUCTOR DEVICES - PART 3: MICRO ELECTROMECHANICAL DEVICES - THIN FILM STANDARD TEST PIECE
    13/30288636 DC : 0 BS EN 60876-1 - FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS - FIBRE OPTIC SPATIAL SWITCHES - PART 1: GENERIC SPECIFICATION
    I.S. EN 62047-25:2016 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 25: SILICON BASED MEMS FABRICATION TECHNOLOGY - MEASUREMENT METHOD OF PULL-PRESS AND SHEARING STRENGTH OF MICRO BONDING AREA
    CEI EN 62047-14 : 2013 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 14: FORMING LIMIT MEASURING METHOD OF METALLIC FILM MATERIALS
    BS EN 62047-1:2016 Semiconductor devices. Micro-electromechanical devices Terms and definitions
    08/30181401 DC : DRAFT APR 2008 BS IEC 60747-14-1 - SEMICONDUCTOR DEVICES - PART 14-1: SEMICONDUCTOR SENSORS - GENERIC SPECIFICATION FOR SENSORS
    17/30355768 DC : 0 BS IEC 62047-32 ED.1.0 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 32: TEST METHOD FOR THE NONLIEAR VIBRATION OF THE MEMS RESONATORS
    NF EN 62047-14 : 2012 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 14: FORMING LIMIT MEASURING METHOD OF METALLIC FILM MATERIALS
    I.S. EN 62047-1:2016 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 1: TERMS AND DEFINITIONS
    IEC 62047-25:2016 Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
    09/30199223 DC : DRAFT JAN 2009 BS EN 60876-1 - FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS - FIBRE OPTIC SPATIAL SWITCHES - PART 1: GENERIC SPECIFICATION
    IEC 60876-1:2014 Fibre optic interconnecting devices and passive components - Fibre optic spatial switches - Part 1: Generic specification
    IEC 62047-14:2012 Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials
    IEC 62047-4:2008 Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
    EN 62047-14:2012 Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials
    EN 62047-4:2010 Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
    CEI EN 62047-4 : 2011 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 4: GENERIC SPECIFICATION FOR MEMS
    14/30296140 DC : 0 BS EN 62047-25 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 25: SILICON-BASED MEMS FABRICATION TECHNOLOGY - MEASUREMENT METHOD OF PULL-PRESS AND SHEARING STRENGTH OF MICRO BONDING AREA
    CEI EN 62047-25 : 1ED 2017 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 25: SILICON BASED MEMS FABRICATION TECHNOLOGY - MEASUREMENT METHOD OF PULL-PRESS AND SHEARING STRENGTH OF MICRO BONDING AREA
    07/30148822 DC : 0 BS IEC 62047-4 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 4: GENERIC SPECIFICATIONS FOR MEMS
    IEC 60747-14-1:2010 Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
    I.S. EN 60876-1:2014 FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS - FIBRE OPTIC SPATIAL SWITCHES - PART 1: GENERIC SPECIFICATION
    EN 60876-1:2014 Fibre optic interconnecting devices and passive components - Fibre optic spatial switches - Part 1: Generic specification

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60050-815:2015 International Electrotechnical Vocabulary (IEV) - Part 815: Superconductivity
    ISO 2041:2009 Mechanical vibration, shock and condition monitoring Vocabulary
    IEC 60050-521:2002 International Electrotechnical Vocabulary (IEV) - Part 521: Semiconductor devices and integrated circuits
    View more information

    • Access your standards online with a subscription

      Features

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective