IEC 62047-10:2011
Current
The latest, up-to-date edition.
Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
26-07-2011
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FOREWORD
1 Scope
2 Normative references
3 Symbols and designations
4 Test piece
5 Testing method and test apparatus
6 Test report
Annex A (informative) - Error estimation using finite
element method
Bibliography
IEC 62047-10:2011 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a specimen is measured, and the compressive modulus of elasticity and yield strength can be obtained. This standard is applicable to metallic, ceramic, and polymeric materials. The contents of the corrigendum of February 2012 have been included in this copy.
| DevelopmentNote |
Stability Date: 2018. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
22
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NF EN 62047-10 : 2012 | Identical |
| NBN EN 62047-10 : 2011 | Identical |
| NEN IEC 62047-10 : 2011 | Identical |
| NEN EN IEC 62047-10 : 2011 | Identical |
| I.S. EN 62047-10:2011 | Identical |
| PN EN 62047-10 : 2012 | Identical |
| UNE-EN 62047-10:2011 | Identical |
| CEI EN 62047-10 : 2012 | Identical |
| EN 62047-10 : 2011 | Identical |
| DIN EN 62047-10:2012-03 | Identical |
| BS EN 62047-10:2011 | Identical |
| PNE-FprEN 62047-10:2010 | Identical |
| ASTM E 9 : 2009 | Standard Test Methods of Compression Testing of Metallic Materials at Room Temperature |
| IEC 62047-8:2011 | Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films |
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