IEC 62047-13:2012
Current
The latest, up-to-date edition.
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
28-02-2012
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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test method
5 Test equipment
6 Test pieces
7 Test conditions
8 Test report
Annex A (informative) - Technical background
Bibliography
IEC 62047-13:2012 specifies the adhesive testing method between micro-sized elements and a substrate using the columnar shape of the specimens. This international standard can be applied to adhesive strength measurement of microstructures, prepared on a substrate, with width and thickness of 1 μm to 1 mm, respectively. This standard specifies the adhesive testing method for micro-sized-elements in order to optimally select materials and processing conditions for MEMS devices. This standard does not particularly restrict test piece material, test piece size and performance of the measuring device, since the materials and size of MEMS device components range widely and testing machine for micro-sized materials has not been generalized.
| DevelopmentNote |
Stability date: 2018. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
30
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NF EN 62047-13 : 2012 | Identical |
| NBN EN 62047-13 : 2012 | Identical |
| NEN EN IEC 62047-13 : 2012 | Identical |
| PN EN 62047-13 : 2012 | Identical |
| UNE-EN 62047-13:2012 | Identical |
| BS EN 62047-13:2012 | Identical |
| CEI EN 62047-13 : 2013 | Identical |
| EN 62047-13:2012 | Identical |
| DIN EN 62047-13:2012-10 | Identical |
| JIS C 5630-13:2014 | Identical |
| PNE-FprEN 62047-13 | Identical |
| IEC 62047-2:2006 | Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials |
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