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IEC 62047-14:2012
Current
The latest, up-to-date edition.
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Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
28-02-2012
FOREWORD
1 Scope
2 Normative references
3 Terms, definitions and symbols
4 Testing method
5 Test procedure and analysis
6 Test report
Annex A (informative) - Principles of the forming limit
diagram
Annex B (informative) - Grid marking method
Annex C (informative) - Gripping method
Annex D (informative) - Strain measuring method
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