IEC TS 62647-22:2013

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviations
4 Approach
5 General Pb-free solder alloy behavior
6 System level service environment
7 High performance electronics testing
8 Solder joint reliability considerations
9 Piece parts
10 Printed circuit boards
11 Printed circuit board (PCB)/printed wiring board
   (PWB) assembly
12 Module assembly considerations
13 Manufacturing resources
14 Aerospace wiring/cabling considerations
15 Rework/repair
16 Generic life testing
17 Similarity analysis
Annex A (informative) - Equipment service environmental
        definition
Bibliography

IEC/TS 62647-22:2013(E) is intended for use as technical guidance by aerospace, defence, and high performance (ADHP) electronic applications and systems suppliers, e.g., original equipment manufacturers (OEMs) and system maintenance facilities, in developing and implementing designs and processes to ensure the continued performance, quality, reliability, safety, airworthiness, configuration control, affordability, maintainability, and supportability of high performance aerospace systems both during and after the transition to Pb-free electronics. The guidelines may be used by the OEMs and maintenance facilities to implement the methodologies they use to ensure the performance, reliability, airworthiness, safety, and certifiability of their products, in accordance with IEC/TS 62647-1:2012. This document also contains lessons learned from previous experience with Pb-free aerospace electronic systems.