• GEIA STD 0006 : 2008

    Current The latest, up-to-date edition.

    REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  01-01-2008

    Publisher:  Government Electronics & Information Technology Association

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    Table of Contents - (Show below) - (Hide below)

    1. SCOPE
    2. REFERENCES
    3. DEFINITIONS AND ACRONYMS
    4. TYPES AND CATEGORIES
    5. GENERAL REQUIREMENTS
    6. DOCUMENTATION
    7. EQUIPMENT, TOOLS, AND MATERIALS
    8. OVERALL PROCESS FLOW
    9. PROCESS QUALIFICATION
    10. PRODUCTION LOT TEST REQUIREMENTS
    11. TEST METHODS
    12. NOTES
    ADDENDUM A - REQUIREMENTS FOR SERVICE FORM
    ADDENDUM B - PROCESS COMPLIANCE MATRIX

    Abstract - (Show below) - (Hide below)

    Describes the requirements for fully replacing undesirable surface finishes using robotic hot solder dip.

    General Product Information - (Show below) - (Hide below)

    Committee G-24
    Document Type Standard
    Publisher Government Electronics & Information Technology Association
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    IEC 62056-4-7:2015 Electricity metering data exchange - The DLMS/COSEM suite - Part 4-7: DLMS/COSEM transport layer for IP networks
    IEC TS 62647-21:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics
    GEIA HB 0005-1 : 2006 PROGRAM MANAGEMENT/SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS
    GEIA HB 0005-2 : 2007 TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
    NASA MSFC STD 3012 : 2012 ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL (EEE) PARTS MANAGEMENT AND CONTROL REQUIREMENTS FOR MSFC SPACE FLIGHT HARDWARE
    NASA JSC 66491 : 2013 STANDARD FOR JSC LEAD-FREE CONTROL PLANS (LFCP)
    PD IEC/TS 62647-21:2013 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Program management. Systems engineering guidelines for managing the transition to lead-free electronics
    BS PD IEC TS 62647-2 : 2012 PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 2: MITIGATION OF DELETERIOUS EFFECTS OF TIN
    IEC TS 62647-22:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
    IEC PAS 62647-22:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
    IEC TS 62647-2:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin
    PD IEC/TS 62647-22:2013 (published 2013-10) Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines

    Standards Referencing This Book - (Show below) - (Hide below)

    J STD 609 : A MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES
    MIL STD 883 : K TEST METHOD STANDARD - MICROCIRCUITS
    EIA 595 : A2009 VISUAL AND MECHANICAL INSPECTION MULTILAYER CERAMIC CHIP CAPACITORS
    J STD 001 : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    MIL PRF 19500 : P SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR
    MIL PRF 38534 : J HYBRID MICROCIRCUITS, GENERAL SPECIFICATION FOR
    J STD 006 : C REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
    J STD 004 : B REQUIREMENTS FOR SOLDERING FLUXES
    J STD 033 : C-1 HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
    GEIA STD 0005-2 : 2012 MITIGATING THE EFFECTS OF TIN WHISKERS IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
    ANSI/NCSL Z540 1 : 94(R2002) CALIBRATION - CALIBRATION LABORATORIES AND MEASURING AND TEST EQUIPMENT - GENERAL REQUIREMENTS
    J STD 002 : D SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
    EIA 469 : E2017 STANDARD TEST METHOD FOR DESTRUCTIVE PHYSICAL ANALYSIS (DPA) OF CERAMIC MONOLITHIC CAPACITORS
    ISO 10012:2003 Measurement management systems — Requirements for measurement processes and measuring equipment
    MIL PRF 38535 : K INTEGRATED CIRCUITS (MICROCIRCUITS) MANUFACTURING, GENERAL SPECIFICATION FOR
    J STD 075 : 0 CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES
    J STD 020 : D-1 MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES
    FED STD 595 : C COLORS USED IN GOVERNMENT PROCUREMENT
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