IEC TS 62647-3:2014
Current
The latest, up-to-date edition.
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes
25-02-2014
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviations
4 Assumption
5 Default test methods
6 Protocol to design and conduct performance tests
7 Final remarks
Annex A (informative) - Test sample size
Annex B (informative) - Material properties of lead-free
solder materials
Annex C (informative) - NASA-DoD lead-free electronics
project test information
Bibliography
IEC TS 62647-3:2014(E) defines for circuit card assemblies a default method for those companies that require a pre-defined approach, and a protocol for those companies that wish to develop their own test methods. The intent of this document is to aid avionics/defence suppliers in satisfying the reliability and/or performance requirements of IEC/TS 62647-1 as well as support the expectations in IEC/TS 62647-21. The default method is intended for use by electronic equipment manufacturers, repair facilities, or programs that may be unable to develop methods specific to their own products and applications. It should be used when little or no other information is available to define, conduct, and interpret results from reliability, qualification, or other tests for electronic equipment containing lead-free (Pb-free) solder. The default method is intended to be conservative, i.e., it is biased toward minimizing the risk to users of avionics electronic equipment.
| Committee |
TC 107
|
| DevelopmentNote |
Supersedes IEC PAS 62647-3. (2/2014) Stability date: 2019. (11/2017)
|
| DocumentType |
Technical Specification
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| NEN NPR IEC/TS 62647-3 : 2014 | Identical |
| PD IEC/TS 62647-3:2014 | Identical |
| GEIA HB 0005-1 : 2006 | PROGRAM MANAGEMENT/SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS |
| IEC TS 62239-1:2015 | Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan |
| 17/30365636 DC : 0 | BS EN 62239-1 ED.1.0 - PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 1: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN |
| PD IEC/TS 62239-1:2015 | Process management for avionics. Management plan Preparation and maintenance of an electronic components management plan |
| GEIA HB 0005-2 : 2007 | TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
| IEC 62137-3:2011 | Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints |
| MIL-STD-810 Revision G:2008 | ENVIRONMENTAL ENGINEERING CONSIDERATIONS AND LABORATORY TESTS |
| IPC 9703 : 0 | IPC/JEDEC MECHANICAL SHOCK TEST GUIDELINES FOR SOLDER JOINT RELIABILITY |
| IEC TS 62647-21:2013 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics |
| GEIA STD 0005-2 : 2012 | MITIGATING THE EFFECTS OF TIN WHISKERS IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
| GEIA HB 0005-1 : 2006 | PROGRAM MANAGEMENT/SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS |
| MIL-HDBK-217 Revision F:1991 | RELIABILITY PREDICTION OF ELECTRONIC EQUIPMENT |
| GEIA STD 0005-1 : 2012 | PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
| IEC TS 62647-1:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan |
| IPC 9701 : A | PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS |
| IEC TS 62647-22:2013 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
| IPC SM 785 : 0 | GUIDELINES FOR ACCELERATED RELIABILITY TESTING OF SURFACE MOUNT ATTACHMENTS |
| IEC TS 62647-2:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin |
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