IEC TS 62878-2-1:2015
Current
The latest, up-to-date edition.
Device embedded substrate - Part 2-1: Guidelines - General description of technology
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
30-03-2015
Important note : Users cannot be edited or removed once added to your Multi user PDF.IEC TS 62878-2-1:2015 describes the basics of device embedding substrate. It is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.
| DevelopmentNote |
Stability date: 2018. (04/2015)
|
| DocumentType |
Technical Specification
|
| Pages |
60
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| PD IEC/TS 62878-2-1:2015 | Identical |
| EN 62878-1-1:2015 | Device embedded substrate - Part 1-1: Generic specification - Test methods |
| BS EN 62878-1-1:2015 | Device embedded substrate Generic specification. Test methods |
| PD IEC/TS 62878-2-3:2015 | Device embedded substrate Guidelines. Design guide |
| IEC TS 62878-2-3:2015 | Device embedded substrate - Part 2-3: Guidelines - Design guide |
| PD IEC/TS 62878-2-4:2015 | Device embedded substrate Guidelines. Test element groups (TEG) |
| IEC TS 62878-2-4:2015 | Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG) |
| I.S. EN 62878-1-1:2015 | DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS |
| IEC TS 62878-2-3:2015 | Device embedded substrate - Part 2-3: Guidelines - Design guide |
| IEC 62421:2007 | Electronics assembly technology - Electronic modules |
| IEC TS 62878-2-4:2015 | Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG) |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
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