IPC 2252 : 0

1 GENERAL
  1.1 Purpose
  1.2 Scope
  1.3 Terms and Definitions
2 APPLICABLE DOCUMENTS
  2.1 IPC
  2.2 American Society for Testing and Materials
  2.3 Society of Automotive Engineers
  2.4 American Society of Mechanical Engineers
  2.5 International Organization for Standardization
  2.6 Reference Information
3 DESIGN CONSIDERATIONS
  3.1 Initial Input
  3.2 Design Options
  3.3 Transmission Line Type, Materials, and
       Components
  3.4 Electrical Design
  3.5 Mechanical Design
  3.6 Preliminary Design Review
  3.7 Breadboard
  3.8 Prototype
  3.9 Documentation
  3.10 Final Design Review
4 DOCUMENTATION REQUIREMENTS
  4.1 Design Features Listing
  4.2 Master Drawing
  4.3 Master Pattern
5 MATERIALS
  5.1 Microwave Printed Circuit Board Materials
  5.2 Bonding Films
  5.3 Metals
  5.4 Conformal Coating
6 ELECTRICAL CHARACTERISTICS
  6.1 Stripline
  6.2 Asymmetric Stripline
  6.3 Microstrip
7 DETAILED BOARD REQUIREMENTS
  7.1 Machined Features
  7.2 Imaging
  7.3 PTFE Activation
  7.4 Metallization
  7.5 Etching
  7.6 Bonding
  7.7 Multiple Material Multilayers
  7.8 Testing
8 DEVICE ATTACHMENTS AND PACKAGING
  8.1 Attaching the Circuit to the Housing
  8.2 Connector Attachment
  8.3 Device Attachment
9 QUALITY ASSURANCE
  9.1 Quality Conformance Evaluations
  9.2 Reliability

Defines RF and microwave circuit design engineers, printed circuit board engineers, packaging engineers and drafters with the information necessary to design practical, functional and cost effective microwave circuit boards in the frequency range of 100 MHz to 30 GHz.