MIL-PRF-31032-6 Revision B:2017
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic or Thermosetting Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications
English
06-10-2017
06-05-2020
1. SCOPE
2. APPLICABLE DOCUMENTS
3. REQUIREMENTS
4. VERIFICATION
5. PACKAGING
6. NOTES
Describes the generic performance requirements for single and double sided (one or two conductor layers) printed wiring boards (hereafter designated printed board) with or without plated holes, constructed of thermoplastic base materials, that will use soldering for component/part mounting.
| DocumentType |
Standard
|
| Pages |
42
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Superseded
|
| SupersededBy |
This specification covers the generic performance requirements for single and double sided (one or two conductor layers) printed wiring boards (hereafter designated printed board) with or without plated holes, constructed of thermoplastic or thermosetting base materials, that will use soldering for component/part mounting (see 6.1). The printed board may contain an external heat sink.
| MIL-PRF-55110 Revision H:2014 | Printed Wiring Board, Rigid, General Specification for |
| IPC A 600 : H | ACCEPTABILITY OF PRINTED BOARDS |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| IPC 2252 : 0 | DESIGN GUIDE FOR RF/MICROWAVE CIRCUIT BOARDS |
| MIL-STD-883 Revision K:2016 | Microcircuits |
| ASTM E 345 : 2016 : REDLINE | Standard Test Methods of Tension Testing of Metallic Foil |
| IPC 9252 : A | REQUIREMENTS FOR ELECTRICAL TESTING OF UNPOPULATED PRINTED BOARDS |
| IPC CC 830 : B | QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES |
| ASTM E 595 : 2015 : REDLINE | Standard Test Method for Total Mass Loss and Collected Volatile Condensable Materials from Outgassing in a Vacuum Environment |
| IPC 2141 : A:2004 | DESIGN GUIDE FOR HIGH-SPEED CONTROLLED IMPEDANCE CIRCUIT BOARDS |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| MIL-PRF-31032 Revision C:2016 | Printed Circuit Board/Printed Wiring Board, General Specification for |
| IPC 2251 : 0 | DESIGN GUIDE FOR THE PACKAGING OF HIGH SPEED ELECTRONIC CIRCUITS |
| ASTM B 567 : 1998 | Standard Test Method for Measurement of Coating Thickness by the Beta Backscatter Method |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| MIL-STD-202-105 Base Document:2015 | Method 105, Barometric Pressure (Reduced) |
| IPC OI 645 : 0 | STANDARD FOR VISUAL OPTICAL INSPECTION AIDS |
| IPC J STD 003 : C | SOLDERABILITY TESTS FOR PRINTED BOARDS |
| MIL-STD-202-214 Base Document:2015 | Method 214, Random Vibration |
| MIL-STD-202-204 Base Document:2015 | Method 204, Vibration, High Frequency |
Please Login or Create an Account so you can add users to your Multi user PDF Later.
Important note : Users cannot be edited or removed once added to your Multi user PDF.