Skip to content
Please enter a keyword to search

  • IPC 4103 : A

    View superseded by
    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
    View superseded by

    SPECIFICATION FOR BASE MATERIALS FOR HIGH SPEED/HIGH FREQUENCY APPLICATIONS

    Available format(s):  Hardcopy

    Superseded date:  11-03-2018

    Language(s): 

    Published date: 

    Publisher:  Institute of Printed Circuits

    Add To Cart

    Table of Contents - (Show below) - (Hide below)

    1 GENERAL
    2 APPLICABLE DOCUMENTS
    3 REQUIREMENTS
    4 QUALITY ASSURANCE PROVISIONS
    5 PREPARATION FOR DELIVERY
    6 NOTES

    Abstract - (Show below) - (Hide below)

    Provides the requirements for high speed/high frequency performance plastic substrates to be used for fabrication of printed boards for microstrip, stripline, and high speed digital electrical and electronic circuits.

    General Product Information - (Show below) - (Hide below)

    Development Note Supersedes IPC L 125. (12/2001) Included in IPC C 107. (06/2008) Included in IPC C 1000. (07/2008) Included in IPC C 105. (12/2011) Also available in Hardcopy format. (03/2018)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Superseded
    Superseded By
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    IPC 2222 FRENCH : A2010 SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS
    IPC 2252 : 0 DESIGN GUIDE FOR RF/MICROWAVE CIRCUIT BOARDS
    IPC 2222 : A SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS
    IPC 2141 : A DESIGN GUIDE FOR HIGH-SPEED CONTROLLED IMPEDANCE CIRCUIT BOARDS
    BS IEC 61182-2:2006 Printed board assembly products. Manufacturing description data and transfer methodology Generic requirements
    IPC 6012 RUSSIAN : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
    IPC 2581 : B GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY
    IPC 2221 GERMAN : B GENERIC STANDARD ON PRINTED BOARD DESIGN
    IPC 6012 POLISH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
    IEC PAS 61182-12:2014 Generic requirements for printed board assembly products manufacturing description data and transfer methodology
    IPC 2222 CHINESE : A SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS
    IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
    IPC 6018 CHINESE : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD
    IPC 2222 GERMAN : A SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS
    PD IEC/PAS 61182-12:2014 Generic requirements for printed board assembly products manufacturing description data and transfer methodology
    IPC 2251 : 0 DESIGN GUIDE FOR THE PACKAGING OF HIGH SPEED ELECTRONIC CIRCUITS
    IPC 6012 FRENCH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
    IPC 2221 FRENCH : B2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
    IPC 6013 GERMAN : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS
    DSCC 10012 : 0 PRINTED WIRING BOARD, RIGID, MULTILAYERED, GENERAL DRAWING
    IEC 61182-2:2006 Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements
    View more information

    • Access your standards online with a subscription

      Features

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective