IPC 4552 : 0

1 SCOPE
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS OF ENIG DEPOSIT
4 QUALITY ASSURANCE PROVISIONS
APPENDIX 1 - Terms and Definitions Not
             Currently in IPC-T-50
APPENDIX 2 - ENIG Process Sequence
APPENDIX 3 - XRF Thickness Measurements
             of Thin Au (ENIG): Recommendations
             for Instrumentation (Detectors) and
             Their Limitations
APPENDIX 4 - ENIG PWB Surface Finish
             Wetting Balance Testing
APPENDIX 5 - IPC 4-14 SC ENIG Round
             Robin Solder Spread Testing
APPENDIX 6 - Wire Bonding to ENIG
APPENDIX 7 - Through Hole Solderability
             Testing
APPENDIX 8 - Evaluation of Electroless
             Nickel Corrosion Due to Immersion
             Gold Plating, Using 3000X Magnification
             After Gold Stripping
APPENDIX 9-A - Cyanide Gold Stripping for
               ENIG
APPENDIX 9-B - Test Method for Potassium
               Iodide/Iodine (Non-Cyanide) ENIG Gold
               Stripping Procedure
APPENDIX 9-C - Method for Stripping Gold
               Plating from ENIG Finished PCBs by
               Broad Beam Argon Ion Milling
APPENDIX 10 - Determination of Thickness
              and Phosphorus Content In Electroless
              Nickel (EN) Layers X-Ray Fluorescence
              (XRF) Spectrometry [IPC-TM-650,
              Method 2.3.44]
APPENDIX 11 - Phosphorus Content Measurement in
              ENIG Using Electron Dispersive
              Spectroscopy EDS - Initial Testing
APPENDIX 12 - Standard Developments Efforts of
              Electroless Nickel Immersion Gold
APPENDIX 13 - Using Guard Bands or a Gauge
              Correction Factor to Accommodate Type 1
              Gauge Study Measurement Uncertainty

Installs requirements for Electroless Nickel/Immersion Gold (ENIG) deposit thicknesses for applications including soldering, wire bonding and as a contact finish.