IPC 4553 : A

1 SCOPE
  1.1 Statement of Scope
  1.2 Description
  1.3 Objective
  1.4 Performance Functions
       1.4.1 Solderability
       1.4.2 Contact Surface
             1.4.2.1 Membrane Switches
             1.4.2.2 Metallic Dome Contacts
       1.4.3 EMI Shielding
       1.4.4 Aluminum Wire Bonding
2 APPLICABLE DOCUMENTS
  2.1 IPC
  2.2 Mil-Standards
  2.3 Telcordia[TM]
3 REQUIREMENTS
  3.1 Visual
  3.2 Finish Thickness
       3.2.1 Immersion Silver (IAg) Thickness
  3.3 Porosity
  3.4 Adhesion
  3.5 Solderability
  3.6 Cleanliness
  3.7 Electrolytic Corrosion Testing
  3.8 Packing and Storage
  3.9 Chemical Resistance
  3.10 High Frequency Signal Loss
  3.11 Microvoids
4 QUALITY ASSURANCE PROVISIONS
  4.1 Qualification
       4.1.1 Sample Test Coupons
  4.2 Acceptance Tests
  4.3 Quality Conformance Testing
APPENDIX 1 - Chemical Definitions
APPENDIX 2 - Process Sequence (Generic)
APPENDIX 3 - Qualification of IAg Process by the Board
             Supplier
APPENDIX 4 - Standard Developments Efforts of Immersion Silver
APPENDIX 5 - X-Ray Fluorescence (XRF) Spectroscopy
APPENDIX 6 - ROUND ROBIN TESTING

Specifies requirements based on performance criteria for the use of Immersion Silver (IAg) as a surface finish for printed circuit boards.